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  • Winbond ships one billionth serial flash memory, ramps 90nm production, increases market share

    WINBOND SHIPS ONE BILLIONTH SERIAL FLASH MEMORY, RAMPS 90NM PRODUCTION, INCREASES MARKET SHARE · First Serial Flash Supplier in Full Production at 12-inch Wafer Fabrication Facility · Expands Family of 90nm Multi I/O SpiFlash Memories from 1 to 128 Megabits Taichung, Taiwan – April 12, 2010 -- Winbo...

  • Winbond launchs 32bit 32M/64Mb SDR/DDR KGD for SiP application

    Winbond launchs 32bit 32M/64Mb SDR/DDR KGD for SiP application Winbond Electronics Corporation (WEC) today announced the launch of its latest 32bit bandwidth 32M/64Mb SDR / DDR DRAM memory which is built on its 65nm bWL process for SiP (System in Package) application. This new product is able to pro...

  • Winbond Electronics Introduces Industry’s Smallest Serial Flash Memories for Space-Critical Applications

    Winbond Electronics Introduces Industry’s Smallest Serial Flash Memories for Space-Critical Applications Densities from 512Kb to 16Mb; USON, WLBGA Packages Reduce Footprint by 80% or more SAN JOSE, Calif., USA, and TAICHUNG, Taiwan– November 16, 2011 -- Winbond Electronics Corp., a leading global su...

  • Winbond Announces the Financial Results for the Second Quarter of 2014

    Hsinchu, Taiwan, Aug. 01, 2014- Winbond Electronics Corporation today announced the financial results for the second quarter of 2014. On a consolidated basis including members of Winbond Electronics Corp. and Nuvoton Technology Corp. etc., net sales were NT$9.742 billion, up 11% QoQ. Gross margin wa...

  • Winbond Electronics Corporation America set to participate in the Freescale Technology Forum (FTF) 2014 Americas

    Date : 2014/4/8-2014/4/11 Location : Dallas, Texas at the Gaylord Texan Resort& Convention Center Booth : Space Plus Winbond Electronics Corporation America will participate in the Freescale Technology Forum (FTF) 2014 Americas as a Silver Sponsor. Come visit Winbond in the Technology Lab April 8 to...

  • Winbond Electronics Corporations in electronica 2014

    Date : 2014/11/11-2014/11/14 Location : New Munich Trade Fair Center Booth : Hall A6 Booth 570/3. Winbond Electronics Corporation is attending the upcoming electronica 2014, 26th international trade fair in Munich, Germany. Come to visit us to learn more about Winbond’s memory solutions for Automoti...

  • Winbond Electronics Corporation America set to participate in the Freescale Technology Forum (FTF) 2014 Americas

    Winbond Electronics Corporation America will participate in the Freescale Technology Forum (FTF) 2014 Americas as a Silver Sponsor. Come visit Winbond in the Technology Lab April 8 to 10, 2014 to learn more about our memory solutions for internet of Things (IoT). More information at www.freescale.co...

  • Winbond Electronics Corporations in electronica 2014

    Date : 2014/11/11-2014/11/14 Location : New Munich Trade Fair Center Booth : Hall A6 Booth 570/3. Winbond Electronics Corporation is attending the upcoming electronica 2014, 26th international trade fair in Munich, Germany. Come to visit us to learn more about Winbond’s memory solutions for Automoti...

  • Winbond Electronics Corporations in Automotive World 2015/ CAR-ELE JAPAN

    Winbond Electronics Corp., Japan will be exhibiting the Automotive related products at the 7th Automotive World 2015/ CAR-ELE JAPAN, the largest showcases in Asia’s Automotive electronics, from January 14-16 at Tokyo Big Sight, Japan. Please come to visit us! For more information about Automotive Wo...

  • Winbond Electronics Corporation at International Common Criteria Conference 2015 (ICCC 2015)

    Winbond Electronics Corporation is pleased to announce the participation in the upcoming ICCC 2015 (International Common Criteria Conference 2015) as a Gold Sponsor. We sincerely invite you to come to visit us to learn more about Winbond’s innovative secure memory solutions, TrustMETM : the world’s ...

  • Winbond Announces Corporate Reorganization Winbond Announces Corporate Reorganization

    (Taipei) Winbond Electronics Corporation today announced a senior management and organization restructuring. The highlights are as follows: Ą°Assistant Vice President James Zhen-Ming Fang, formerly responsible for the successful operation of Winbond's 8-inch DRAM wafer fab, has been assigned to mana...

  • Earthquake Report

    (Taipei News) Subsequent to an earthquake of 6.7 magnitude that struck Taiwan at 2:23 a.m. on June 11 2000, Winbond Electronics Corporation today issued the following report on the status of Company facilities. After 20 hours of thorough facilities inspection and exhaustive safety reviews, the Compa...

  • Winbond Electronics To Exhibit Innovative Chip Industry Ultra Pure Water System and Recycling System

    (Hsin Chu News) Winbond Electronics Corporation, a leading supplier of semiconductor solutions, today announced that it is showcasing a new Ultra Pure Water System and Water Recycling System for recycling waste water at its wafer fabrication site. This new system, sponsored by Hsin Chu Science Park ...

  • Winbond Electronics Corporation Announces Signing of Definitive Agreement with Infineon Technologies AG for Licensing 0.11-Micron DRAM Technology

    (Taipei News) Winbond Electronics Corporation today announced the signing of a definitive agreement with Infineon Technologies AG for licencing 0.11-micron DRAM technology. The signing of the formal contract marks the first technology agreement between the two companies. Under the terms of the agree...

  • The subsequent to the electric power shut down in Science-Based Industrial Park last weekend, Winbond today issued that the impact to the company

    Contents: 1.Date of occurrence of the event:2004/04/10 2.Cause of occurrence:electric power shut down 3.Countermeasures:the N/A 4.Any other matters that need to be specified: There are waferloss around NT$ 3 million and the wafer productivity loss around half a day totally after the estimation of th...

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