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  • Winbond Announces the Financial Results for the Second Quarter of 2014

    Hsinchu, Taiwan, Aug. 01, 2014- Winbond Electronics Corporation today announced the financial results for the second quarter of 2014. On a consolidated basis including members of Winbond Electronics Corp. and Nuvoton Technology Corp. etc., net sales were NT$9.742 billion, up 11% QoQ. Gross margin wa...

  • Winbond Electronics Corporations in electronica 2014

    Date : 2014/11/11-2014/11/14 Location : New Munich Trade Fair Center Booth : Hall A6 Booth 570/3. Winbond Electronics Corporation is attending the upcoming electronica 2014, 26th international trade fair in Munich, Germany. Come to visit us to learn more about Winbond’s memory solutions for Automoti...

  • Winbond Electronics Corporations in electronica 2014

    Date : 2014/11/11-2014/11/14 Location : New Munich Trade Fair Center Booth : Hall A6 Booth 570/3. Winbond Electronics Corporation is attending the upcoming electronica 2014, 26th international trade fair in Munich, Germany. Come to visit us to learn more about Winbond’s memory solutions for Automoti...

  • Winbond Electronics Corporations in Automotive World 2015/ CAR-ELE JAPAN

    Winbond Electronics Corp., Japan will be exhibiting the Automotive related products at the 7th Automotive World 2015/ CAR-ELE JAPAN, the largest showcases in Asia’s Automotive electronics, from January 14-16 at Tokyo Big Sight, Japan. Please come to visit us! For more information about Automotive Wo...

  • Winbond Announces Corporate Reorganization Winbond Announces Corporate Reorganization

    (Taipei) Winbond Electronics Corporation today announced a senior management and organization restructuring. The highlights are as follows: Ą°Assistant Vice President James Zhen-Ming Fang, formerly responsible for the successful operation of Winbond's 8-inch DRAM wafer fab, has been assigned to mana...

  • Earthquake Report

    (Taipei News) Subsequent to an earthquake of 6.7 magnitude that struck Taiwan at 2:23 a.m. on June 11 2000, Winbond Electronics Corporation today issued the following report on the status of Company facilities. After 20 hours of thorough facilities inspection and exhaustive safety reviews, the Compa...

  • Winbond Electronics To Exhibit Innovative Chip Industry Ultra Pure Water System and Recycling System

    (Hsin Chu News) Winbond Electronics Corporation, a leading supplier of semiconductor solutions, today announced that it is showcasing a new Ultra Pure Water System and Water Recycling System for recycling waste water at its wafer fabrication site. This new system, sponsored by Hsin Chu Science Park ...

  • Winbond Electronics Corporation Announces Signing of Definitive Agreement with Infineon Technologies AG for Licensing 0.11-Micron DRAM Technology

    (Taipei News) Winbond Electronics Corporation today announced the signing of a definitive agreement with Infineon Technologies AG for licencing 0.11-micron DRAM technology. The signing of the formal contract marks the first technology agreement between the two companies. Under the terms of the agree...

  • The subsequent to the electric power shut down in Science-Based Industrial Park last weekend, Winbond today issued that the impact to the company

    Contents: 1.Date of occurrence of the event:2004/04/10 2.Cause of occurrence:electric power shut down 3.Countermeasures:the N/A 4.Any other matters that need to be specified: There are waferloss around NT$ 3 million and the wafer productivity loss around half a day totally after the estimation of th...

  • Winbond Electronics Corporation announced the project for building a fabrication plant of 12" has obtained approval from the board meeting

    (Taipei News) Winbond Electronics Corporation announced that the project for building a fabrication plant of 12" has obtained approval from the board meeting on April 30. According to the project, the construction of said plant will break ground at the 3rd quarter of 2004 at Taichun Science-based In...

  • Winbond Electronics Corporation held the ground breaking ceremony for the 12 inch fabrication plant at Central Taiwan Science Park

    Winbond Electronics Corporation held its ground breaking ceremony for the new 12-inch fab at Central Taiwan Science Park on July 23. Guests present to witness this historical event included Mao-Kun Wu, Minister of the National Science Council, Wen-Ke Yang, Deputy General Director of the Central Taiw...

  • Winbond Electronics Corporation Sells FPD (Flat Panel Display) Business to Cheertek Technology, Inc.

    (Taipei News) Winbond Electronics Corp. announced today that the Board of Directors approved the sale of the Flat Panel Display business to Cheertek Technology, Inc. for around NT $0.4 billion. The Driver IC of the FPD (Flat Panel Display) products is one of the product lines in Winbond's Logic Busi...

  • Winbond Electronics held the grand opening ceremony for its 12 -inch fabrication plant at Central Taiwan Science Park

    (Taipei News) Winbond Electronics Corporation held its grand opening ceremony for the new 12-inch fab at Central Taiwan Science Park on April 20. Guests in presence to witness this historical event included Hung-Duen Yang, Deputy Minister of the National Science Council, Wen-Ke Yang, Deputy General ...

  • Winbond sells 200mm fab to VIS

    (Taipei News)Winbond Electronics Corporation announced that yesterday the Board of Directors has approved the deal to sell the 200mm fab, which is located in Li-Shin Rd. Hsinchu Science Park, to Vanguard International Semiconductor Corporation (VIS) for about 8.3 billion NTD. The trade includes fact...

  • Winbond Electronics Corporation and Qimonda AG Announce New Agreement for 75 nanometer and 58 nanometer Technology Transfer

    June 27, 2007—Winbond Electronics Corporation and Qimonda AG today announced signing a new agreement for 75nm and 58nm DRAM trench technology transfer and production capacity collaboration, which demonstrates that Winbond continuously keeps implementing advanced production technologies to strengthen...

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