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Introducing products for broad range applications: 256Mb, 512Mb, <span class="match">1Gb</span> DDR2 SDRAM Winbond has introduced a family of DDR2 SDRAM products based on advanced DRAM technology, including 256Mb (W9725G6IB series), 512Mb (W9751G6IB series) and <span class="match">1Gb</span> (W971GG6IB series). These products are all in compliance with...

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https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA00-W97AHXNB.html&level=1

Taichung, Taiwan – 2024-08-07 - Winbond Electronics Corporation, a leading global supplier of semiconductor solutions, has unveiled the W25N01KW, a <span class="match">1Gb</span> 1.8V QspiNAND flash. This new NAND solution is designed to meet the increasing demands of wearable and battery-operated IoT devices with low standby...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2024_0807_unveiled_1gb_qspinand_wearable_lowpower_IoT.html?__locale=en

(HSINCHU, Taiwan –29TH April, 2020) -- With the rapid rise of Internet of Things (IoT) combining with artificial intelligence (AI) technologies, the emerging application w/ AI engine boosting to be powerful and popular in coming years. To image that the affordable AIoT device can guide people how to...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-powering-aiot-and-8k-tv-with-1gb-lpddr3.html?__locale=en

Micro ships its TX510 AI processor with a Winbond <span class="match">1Gb</span> LPDDR3 die integrated into a single SiP Executing up to 1.2T(Int8), the TX510 SoC sets the pace in biometric and 3D sensing applications, backed by the 1866Mb/s bandwidth of the Winbond DRAM TAICHUNG, Taiwan – December 16, 2020 – Winbond Electron...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-1gb-lpddr3-in-tsing-micro-new-ai-image-processing-soc.html?__locale=en

Winbond supplies the low-power, high-bandwidth <span class="match">1Gb</span> LPDDR3 DRAM die in the KL720 SoC Kneron’s KL720 with Winbond DRAM inside sets new industry benchmark for power/performance ratio in edge AI applications TAICHUNG, Taiwan – September 22, 2020 – Winbond Electronics Corporation, a leading global suppli...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/high-bandwidth-1gb-lpddr3-helps-kneron-kl720-achieve-1.4-tops-throughput-in-edge-ai.html?__locale=en

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