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キーワードの捜索結果“ Mobile ”, 217項目の結果
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  • Winbond Announces the Financial Results for the Second Quarter of 2017

    Hsinchu, Taiwan, July.28, 2017- Winbond Electronics Corporation today announced the financial results for the second quarter of 2017. On a consolidated basis including members of Winbond Electronics Corp. and Nuvoton Technology Corp. etc., net sales in Q2,2017 were NT$11.411 billion, up 9% QoQ. Gros...

  • オートモーティブ ワールド2015/カーエレジャパン

    Winbond Electronics Corp., Japan will be exhibiting the Automotive related products at the 7th Automotive World 2015/ CAR-ELE JAPAN, the largest showcases in Asia’s Automotive electronics, from January 14-16 at Tokyo Big Sight, Japan. Please come to visit us! For more information about Automotive Wo...

  • 5G携帯モデム用の新たな低コストメモリソリューション、超高速ワイヤレスブロードバンドの採用を促進

    5Gは次世代スマートフォン向けの超高速モバイルブロードバンドや誤作動の許されない緊急サービス通信ネットワーク、革新的なIoTやスマートシティアプリケーション用の低電力・常時接続無線の高密度アレイなど、さまざまなユースケースと製品タイプをサポートするテクノロジープラットフォームです。 このテクノロジーは非常に高いポテンシャルを持っていますが、幅広く採用されるには時間がかる見込みで、まだ一般消費者市場にはほとんど出回っていません。 2020年東京オリンピックなどのイベントは、5Gの消費者採用を広めるきっかけとなると期待されていますが、現時点では、世界の多くの地域で初期導入段階にあります。 5Gの展...

  • モバイルDRAM

    ウィンボンドは、コンシューマ、コンピュータ、通信及びその他電子製品に、半導体ソリューションを提供する有数のメーカーです。これまでに、IDD電流値の低いモバイルDRAMを開発していますが、現在はモバイル用DRAMメモリを、モバイルフォンやタブレットのみならず、一般消費者向けモバイル製品や通信の分野へと拡大しています。弊社のモバイルDRAMデバイスは、データ幅としてはx16とx32の両方をサポートしており、主な特長としては、シーケンシャルバーストあるいはインターリーブバースト、高いクロック速度、標準的なセルフリフレッシュ、パーシャル・アレイ・セルフリフレッシュ(PASR)、温度センサによるセルフリ...

  • Winbond releases Pseudo SRAM(W96 Series)

    At this year's eMEX 2006, Winbond Electronics launched the Pseudo SRAM with the largest density in the market. The W968D6B has the following key features: W96 Series Pseudo SRAM Conforms to CellularRAM 1.5G standard Density: 256Mb (16M x 16) Low operating voltage and input/output voltage: 1.8V Frequ...

  • Winbond releases 256Mb LowPower DRAM

    Winbond has launched a range of Low Power DRAM memory components designed to meet the needs of mobile devices. Shown at eMEX 2006 this year is the W988D6E / W988D2E 256MB Low Power DRAM. Its key features are: W98 Series LPSDR SDRAM (Single Data Rate Synchronous DRAM) Conforms to the JEDEC standard 2...

  • Winbond to Display Multiple Key Chips and IC Design Technologies at 2007 IIC-China

    Winbond 2007 IIC-China Shenzhen March 5-6 th , Shenzhen Convention and Exhibition Center Booth No.:2C25 Shanghai March 13-14 th, Shanghai Mart Booth No.:4C07 Winbond will attend the upcoming International IC China (IIC-China) Exhibition hosted by Global Sources. Multiple Winbond IC designs as well a...

  • Winbond Electronics Releases Largest Capacity Pseudo SRAM on the Market

    At this year's IIC 2007, Winbond Electronics launched the Pseudo SRAM with the largest density in the market. The W968D6B has the following key features: W96 Series Pseudo SRAM Conforms to CellularRAM 1.5G standard Density: 256Mb (16M x 16) Low operating voltage and input/output voltage: 1.8V Freque...

  • Winbond Electronics Unveils 256MB LowPower DRAM

    Winbond has launched a range of Low Power DRAM memory components for mobile devices. The W988D6E / W988D2E 256 MB Low Power DRAM will be shown at IIC 2007. LP SDR/DDR will become Mainstream In recent years there has been an upsurge in sales of replacement mobile phones. The driving force behind this...

  • Winbond Announces New Flash Memory Products-16Mb/32Mb SPI & 16Mb/32Mb/64Mb Parallel

    16Mb ,32Mb and 64 Mb parallel Flash memories 16Mb and 32Mb are 70ns, Boot Block and Single Bank Architecture 64Mb is 70ns, Boot Block and supports page mode, and Flexible Bank architecture 16 and 32 Mb SpiFlash ® memories support space-saving, cost-effective SO8 package Dual-Output SPI supports more...

  • Winbond Electronics Releases Largest Capacity CellularRAM on the Market

    SemiTech Taipei 2007, May, 10~12, 2007- With the emergence of a new generation of handheld devices, Winbond Electronics Corp. brings 256 Mb Pseudo SRAM to the market. Focusing on niche memory IDM, Winbond launches largest available 256 Mb CellularRAM standard PSRAM; this density is the best choice f...

  • Winbond announces new Flash Memory products-16Mb/32Mb SPI & 16Mb/32Mb/64Mb Parallel

    16Mb ,32Mb and 64 Mb parallel Flash memories o 16Mb and 32Mb are 70ns, Boot Block and Single Bank Architecture o 64Mb is 70ns, Boot Block and supports page mode, and Flexible Bank architecture 16 and 32 Mb SpiFlash® memories support space-saving, cost-effective SO8 package o Dual-Output SPI supports...

  • Winbond Introduces Industry's First QUAD-SPI Serial Flash Memory

    • W25Q16 SpiFlash Memory Offers Single, Dual, Quad I/Os in Space-Saving 8-Pin Package • 320Mhz-Equivalent Clock Rate Gives More than 6X Performance Boost • Cost-Effective, Code-Execution Alternative to Parallel NOR Flash SAN JOSE, Calif. – Aug 7, 2007 -- Winbond Electronics Corporation announced tod...

  • Winbond Launches Low Power Mobile Memory in 2007 Hongzhou eif

    Winbond Electronics Corp. will attend the upcoming Electronics & Information Fair, Hangzhou, China 2007(eif) Exhibition hosted by the Taiwan Electrical and Electronic Manufacturers' Association (TEEMA), Hangzhou Municipal Government and Trade Development Bureau of Ministry of Commerce during Sep.5 t...

  • Winbond to Display Multiple Key Chips and IC Design Technologies at Electronics & Information Fair, Hangzhou, China 2007

    Date : Sep/5/2007-Sep/8/2007 Location : Hangzhou Peace International Exhibition & Conference Center Booth : H13-23, G14-24 Winbond Electronics Corp. will attend the upcoming Electronics & Information Fair, Hangzhou, China 2007(eif) Exhibition hosted by the Taiwan Electrical and Electronic Manufactur...

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