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キーワードの捜索結果“ wafer ”, 126項目の結果
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  • オートモーティブ ワールド2015/カーエレジャパン

    Winbond Electronics Corp., Japan will be exhibiting the Automotive related products at the 7th Automotive World 2015/ CAR-ELE JAPAN, the largest showcases in Asia’s Automotive electronics, from January 14-16 at Tokyo Big Sight, Japan. Please come to visit us! For more information about Automotive Wo...

  • Winbond to Display Multiple Key Chips and IC Design Technologies at 2007 IIC-China

    Winbond 2007 IIC-China Shenzhen March 5-6 th , Shenzhen Convention and Exhibition Center Booth No.:2C25 Shanghai March 13-14 th, Shanghai Mart Booth No.:4C07 Winbond will attend the upcoming International IC China (IIC-China) Exhibition hosted by Global Sources. Multiple Winbond IC designs as well a...

  • Winbond Electronics Releases Largest Capacity Pseudo SRAM on the Market

    At this year's IIC 2007, Winbond Electronics launched the Pseudo SRAM with the largest density in the market. The W968D6B has the following key features: W96 Series Pseudo SRAM Conforms to CellularRAM 1.5G standard Density: 256Mb (16M x 16) Low operating voltage and input/output voltage: 1.8V Freque...

  • Winbond Electronics Unveils 256MB LowPower DRAM

    Winbond has launched a range of Low Power DRAM memory components for mobile devices. The W988D6E / W988D2E 256 MB Low Power DRAM will be shown at IIC 2007. LP SDR/DDR will become Mainstream In recent years there has been an upsurge in sales of replacement mobile phones. The driving force behind this...

  • Winbond Announces New Flash Memory Products-16Mb/32Mb SPI & 16Mb/32Mb/64Mb Parallel

    16Mb ,32Mb and 64 Mb parallel Flash memories 16Mb and 32Mb are 70ns, Boot Block and Single Bank Architecture 64Mb is 70ns, Boot Block and supports page mode, and Flexible Bank architecture 16 and 32 Mb SpiFlash ® memories support space-saving, cost-effective SO8 package Dual-Output SPI supports more...

  • Winbond Introduces products for broad range applications: 64Mb, 128Mb, and 256Mb SDRAM

    Winbond is introducing new SDRAM products for broad range applications, including: 64Mb (W9864 series), 128Mb (W9812 series), and 256Mb (W9825 series). These products will be on exhibition at the 2007 Taipei Semiconductor Industry Exhibition, and have passed SGS inspection, JGPSSI standards. The SDR...

  • Winbond 16Mb, 32Mb Serial Flash Memories Production-Released; Set Course For Next Generation

    New 25X16, 25X32 SpiFlash® Memories: Fast, Efficient, Cost-Saving Solutions for Computer, Networking, Consumer Applications Dual-SPI Gains Market Acceptance; Quad-SPI on the Horizon SAN JOSE , Calif. – June 25, 2007 -- Winbond Electronics Corporation America, a wholly owned subsidiary of Winbond Ele...

  • Winbond Announces New Flash Memory Products-16Mb/32Mb/64Mb Parallel Flash

    16 Mb (W19B160B), 32 Mb (W19B320B) and 64 Mb (W19B640C) parallel flash memories 16 Mb and 32 Mb: 70 ns, Boot Block and Single Bank Architecture 64 Mb: 70 ns, Boot Block (supports page mode), and Flexible Bank Architecture Over the past 12 years, Winbond has devoted itself to the flash memory market,...

  • Winbond Launches Low Power Mobile Memory in 2007 Hongzhou eif

    Winbond Electronics Corp. will attend the upcoming Electronics & Information Fair, Hangzhou, China 2007(eif) Exhibition hosted by the Taiwan Electrical and Electronic Manufacturers' Association (TEEMA), Hangzhou Municipal Government and Trade Development Bureau of Ministry of Commerce during Sep.5 t...

  • Winbond Announces New Flash Memory Products - 16Mb/32Mb/64Mb Parallel Flash

    16 Mb (W19B160B), 32 Mb (W19B320B) and 64 Mb (W19B640C) parallel flash memories 16 Mb and 32 Mb: 70 ns, Boot Block and Single Bank Architecture 64 Mb: 70 ns, Boot Block (supports page mode), and Flexible Bank Architecture (Hsinchu, Taiwan – Sep 17, 2007)Over the past 12 years, Winbond has devoted it...

  • Winbond Electronics Presents Low Power Mobile Memory

    Winbond is attending the 2008 IIC-China Shenzhen (Mar./3-4 Shenzhen Convention and Exhibition Center) & Shanghai (Mar./10-11 Shanghai Mart). We are glad to introduce Winbond's two new families of Mobile Memory components for mobile applications, Low Power DRAM and PSRAM that meet the increasing need...

  • Winbond is attending the Taitronics 2008. We are glad to introduce Winbond’s two new families of Mobile Memory components for mobile applications, Mobile DRAM and PSRAM.

    Winbond is attending the Taitronics 2008 (Oct. 7-11, Taipei World Trade Center Nangang Exhibition Hall, Booth: 4F M102). We are glad to introduce Winbond’s two new families of Mobile Memory components for mobile applications, Mobile DRAM and PSRAM that meet the increasing need of low power consumpti...

  • Winbond is attending the Taitronics 2008 and introducing products for broad range applications

    Introducing products for broad range applications: 16Mb, 64Mb, 128Mb, 256Mb SDRAM Winbond is attending the Taitronics 2008 (Oct. 7-11, Taipei World Trade Center Nangang Exhibition Hall, Booth: 4F M102). We are glad to introduce our SDRAM products for broad range applications, including: 16Mb (W9816 ...

  • Winbond Introduces Products for Broad Range Applications: 256Mb, 512Mb, 1Gb DDR2 SDRAM

    Introducing products for broad range applications: 256Mb, 512Mb, 1Gb DDR2 SDRAM Winbond has introduced a family of DDR2 SDRAM products based on advanced DRAM technology, including 256Mb (W9725G6IB series), 512Mb (W9751G6IB series) and 1Gb (W971GG6IB series). These products are all in compliance with...

  • Winbond ships one billionth serial flash memory, ramps 90nm production, increases market share

    WINBOND SHIPS ONE BILLIONTH SERIAL FLASH MEMORY, RAMPS 90NM PRODUCTION, INCREASES MARKET SHARE · First Serial Flash Supplier in Full Production at 12-inch Wafer Fabrication Facility · Expands Family of 90nm Multi I/O SpiFlash Memories from 1 to 128 Megabits Taichung, Taiwan – April 12, 2010 -- Winbo...

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