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https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=uk&xmlPath=/support/resources/.content/item/DA00-W25X10L-20L-40L-80L.html&level=1

Winbond is offering a new way to extend the power savings available from Partial Array Self-Refresh (PASR), which was already specified in the JEDEC standard by implementing a new Deep Self-Refresh (DSR) mode. DSR operates in a similar way to PASR at <span class="match">low</span> data rates, allocating used data to one or mo...

https://www.winbond.com/hq/hq/support/online-learning/video-item/video00003.html?__locale=uk

Winbond is attending the 2008 IIC-China Shenzhen (Mar./3-4 Shenzhen Convention and Exhibition Center) & Shanghai (Mar./10-11 Shanghai Mart). We are glad to introduce Winbond's two new families of Mobile Memory components for mobile applications, Low Power DRAM and PSRAM that meet the increasing need...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-presents-low-power-mobile-memory.html?__locale=uk

https://www.winbond.com/hq/support/online-learning/video-item/Ultra-Low-Power-DRAM-A-Green-Memory-in-IoT-Devices

New 1.2V, 1.5V Devices Feature Small 8-Pin Packages SAN JOSE, Calif., USA, and TAICHUNG, Taiwan – June 29, 2017 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced a dramatic expansion of its flash product portfolio with the introduction of...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-introduces-first-very-low-voltage-flash.html?__locale=uk

Winbond HYPERRAM™ delivers <span class="match">low</span> power and <span class="match">low</span> pin count, speeds graphics, and optimizes UI display refresh Mobiveil’s HYPERRAM Controller IP enables SoC Designers to leverage Winbond’s HYPERBUS based HYPERRAM x8/x16 - 250 MHz Memory TAICHUNG, Taiwan –2023-08-30 – Winbond Electronics Corporation, a le...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2023_0830_winbond_mobiveil_collaborate_ultra-low_power_applications.html?__locale=uk

Winbond Electronics Corp. will attend the upcoming Electronics & Information Fair, Hangzhou, China 2007(eif) Exhibition hosted by the Taiwan Electrical and Electronic Manufacturers' Association (TEEMA), Hangzhou Municipal Government and Trade Development Bureau of Ministry of Commerce during Sep.5 t...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-launches-low-power-mobile-memory-in-2007-hongzhou-eif.html?__locale=uk

Winbond HyperRAM™ delivers <span class="match">low</span> power and <span class="match">low</span> pin count, speeds graphics, and optimizes UI display refresh Ambiq's Apollo4™ ultra-<span class="match">low</span> power SoC is purpose-built to serve as both an application processor and a coprocessor for battery-powered endpoint devices TAICHUNG, Taiwan– 2021-05-25– Winbond Elect...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-and-ambiq-collaborate-on-ultra-low-power-intelligent-iot-and-wearables.html?__locale=uk

Taichung, Taiwan – 2024-08-07 - Winbond Electronics Corporation, a leading global supplier of semiconductor solutions, has unveiled the W25N01KW, a 1Gb 1.8V QspiNAND flash. This new NAND solution is designed to meet the increasing demands of wearable and battery-operated IoT devices with <span class="match">low</span> standby...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2024_0807_unveiled_1gb_qspinand_wearable_lowpower_IoT.html?__locale=uk

Highlights Winbond’s corporate commitment to address environmental and sustainability issues on a global scale Company’s Flash Memory products in SON and BGA packages will support LTS this month Moving to LTS also helps simplify and shorten the SMT Process, and reduce production costs TAICHUNG, Taiw...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond_adopts_low_temperature_soldering_lts_slow_global_warming.html?__locale=uk

https://www.winbond.com/hq/support/online-learning/articles-item/High-Performance-Low-Power-Small-Form-factor-Flash-Memory-for-Next-Generation-Devices

The edge artificial intelligence (AI) chipset market is expected to exceed the cloud AI chipset market for the first time in 2025. According to global tech market advisory firm, ABI Research, the edge AI chipset market will reach US$12.2 billion in revenues, outpacing the cloud AI chipset market, wh...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/low-density-lpddr4x-dram-for-edge-ai.html?__locale=uk

Today, the circuitry on the board in mainstream industrial and consumer products operates from a wide range of supply voltages: the power rails are most commonly at 5V, 3V, 2.5V, 1.8V and various <span class="match">low</span>er voltages. To ensure compatibility between devices from different manufacturers, and to avoid unnec...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/the-keys-to-successful-adoption-of-new-low-voltage-memory.html?__locale=uk

MUNICH, Germany – 13 November 2018 -- Winbond Electronics Corporation is scheduled to present a new-generation ultra-<span class="match">low</span>-power (ULP) DRAM at the 2018 electronica conference being held in Germany this November. The ultra-<span class="match">low</span> power and high performance of this product make it particularly suitable for...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-reveals-a-new-ultra-low-power-mobile-dram-at-2018-electronica.html?__locale=uk