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Mobile DRAM - Low Power DDR SDRAM
LPDDR SDRAM
Mobile phones have become an integral part of our daily lives providing a compact platform for work and play. With newer software requiring faster computing, optimized RAM makes all the difference. Low power DDR SDRAM is a synchronous DRAM optimized for numerous IoT applications. SEARCH FOR THE PROD...
https://www.winbond.com/hq/hq/product/mobile-dram/low-power-ddr-sdram/index.html?__locale=uk
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Mobile DRAM - Low Power SDR SDRAM
LPSDR SDRAM
In addition to ultra-high-speed data processing, modern IoT devices require long-lasting batteries. To achieve this, onboard RAM needs to operate efficiently by using the <span class="match">low</span>est possible power settings. Low power synchronous dynamic RAM (Low power SDRAM) integrates energy-saving technology that allo...
https://www.winbond.com/hq/hq/product/mobile-dram/low-power-sdr-sdram/index.html?__locale=uk
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Mobile DRAM - Low Power DDR2 SDRAM
LPDDR2 SDRAM
The use of double data rate synchronous dynamic random-access memory (DDR SDRAM) in modern IoT devices has significantly improved computer data processing. While DDRs al<span class="match">low</span> faster data transmission than single rate memories, the improved performance often translates to greater power consumption. Low...
https://www.winbond.com/hq/hq/product/mobile-dram/low-power-ddr2-sdram/index.html?__locale=uk
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Mobile DRAM - Low Power DDR3 SDRAM
LPDDR3 SDRAM
With the increasing functionality of IoT processes, mobile device developers are constantly searching for smaller, faster memory chips to integrate into their products. While standard DDR RAM chips are optimized for ultra-fast data processing, <span class="match">low</span> power variants like the LPDDR3 are an excellent choi...
https://www.winbond.com/hq/hq/product/mobile-dram/low-power-ddr3-sdram/index.html?__locale=uk
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Mobile DRAM - Low Power DDR4/4X SDRAM
LPDDR4/4X SDRAM
Low-Density Memory for AI-Enabled Devices Many smartphones, smart vehicles, wearables, and several other IoT devices now integrate edge AI to optimize their processes. These devices require ultra-fast data processing memories to perform optimally. Low power DDR4 SDRAM especially the LPDDR4X variants...
https://www.winbond.com/hq/hq/product/mobile-dram/low-power-ddr4-ddr4x-sdram/index.html?__locale=uk
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Winbond Introduces First Very-Low-Voltage Flash Memories
Other
https://www.winbond.com/hq/hq/about-winbond/company-profile/milestones/?__locale=uk
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W25X10L/20L/40L/80L Data Sheet for Low Voltage
Datasheet
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=uk&xmlPath=/support/resources/.content/item/DA00-W25X10L-20L-40L-80L.html&level=1
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Winbond Electronics Presents Low Power Mobile Memory
News
Winbond is attending the 2008 IIC-China Shenzhen (Mar./3-4 Shenzhen Convention and Exhibition Center) & Shanghai (Mar./10-11 Shanghai Mart). We are glad to introduce Winbond's two new families of Mobile Memory components for mobile applications, Low Power DRAM and PSRAM that meet the increasing need...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-presents-low-power-mobile-memory.html?__locale=uk
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Ultra Low Power DRAM A “Green” Memory in IoT Devices
https://www.winbond.com/hq/support/online-learning/video-item/Ultra-Low-Power-DRAM-A-Green-Memory-in-IoT-Devices
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Winbond Introduces First Very-Low-Voltage Flash Memories
News
New 1.2V, 1.5V Devices Feature Small 8-Pin Packages SAN JOSE, Calif., USA, and TAICHUNG, Taiwan – June 29, 2017 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced a dramatic expansion of its flash product portfolio with the introduction of...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-introduces-first-very-low-voltage-flash.html?__locale=uk
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Winbond and Mobiveil Collaborate on Ultra-Low Power Applications
News
Winbond HYPERRAM™ delivers <span class="match">low</span> power and <span class="match">low</span> pin count, speeds graphics, and optimizes UI display refresh Mobiveil’s HYPERRAM Controller IP enables SoC Designers to leverage Winbond’s HYPERBUS based HYPERRAM x8/x16 - 250 MHz Memory TAICHUNG, Taiwan –2023-08-30 – Winbond Electronics Corporation, a le...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2023_0830_winbond_mobiveil_collaborate_ultra-low_power_applications.html?__locale=uk
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Winbond Launches Low Power Mobile Memory in 2007 Hongzhou eif
News
Winbond Electronics Corp. will attend the upcoming Electronics & Information Fair, Hangzhou, China 2007(eif) Exhibition hosted by the Taiwan Electrical and Electronic Manufacturers' Association (TEEMA), Hangzhou Municipal Government and Trade Development Bureau of Ministry of Commerce during Sep.5 t...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-launches-low-power-mobile-memory-in-2007-hongzhou-eif.html?__locale=uk
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Winbond and Ambiq Collaborate on Ultra-Low Power, Intelligent IoT, and Wearables
News
Winbond HyperRAM™ delivers <span class="match">low</span> power and <span class="match">low</span> pin count, speeds graphics, and optimizes UI display refresh Ambiq's Apollo4™ ultra-<span class="match">low</span> power SoC is purpose-built to serve as both an application processor and a coprocessor for battery-powered endpoint devices TAICHUNG, Taiwan– 2021-05-25– Winbond Elect...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-and-ambiq-collaborate-on-ultra-low-power-intelligent-iot-and-wearables.html?__locale=uk
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Winbond has unveiled its latest 1Gb QspiNAND Flash for wearable and low-power IoT devices
News
Taichung, Taiwan – 2024-08-07 - Winbond Electronics Corporation, a leading global supplier of semiconductor solutions, has unveiled the W25N01KW, a 1Gb 1.8V QspiNAND flash. This new NAND solution is designed to meet the increasing demands of wearable and battery-operated IoT devices with <span class="match">low</span> standby...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2024_0807_unveiled_1gb_qspinand_wearable_lowpower_IoT.html?__locale=uk
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Winbond Adopts Low Temperature Soldering (LTS) to Slow the Pace of Global Warming
News
Highlights Winbond’s corporate commitment to address environmental and sustainability issues on a global scale Company’s Flash Memory products in SON and BGA packages will support LTS this month Moving to LTS also helps simplify and shorten the SMT Process, and reduce production costs TAICHUNG, Taiw...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond_adopts_low_temperature_soldering_lts_slow_global_warming.html?__locale=uk
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