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https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000018.html&level=1

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA00-W25M121AV.html&level=1

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA00-W25M321AV.html&level=1

概述 华邦SpiFlash/<span class="match">SpiStack</span>测试开发包是一个基于 Mbed OS 启动之MCU主控板，用以搭配Arduino UNO R35终端及其衍生扩充板或子板。您可透过此套件轻松尝试Quad SPI闪存之操作。 a)Mbed OS 启动之MCU主控板 Part Number MCU Supplier M487JIDAE Nuvoton Technology b)扩充板 c)子板 Part Number Density Product Type Operation Temperature W25Q128JVEIQ 128Mb 3.3V Serial NOR Flash Memory Ind...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/events/product-promotion/promotion00020.html?__locale=zh

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA00-W25M161AV.html&level=1

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000014.html&level=4

针对不同应用领域可灵活组合成不同容量的全新系列产品 (2016年4月12日加州圣荷西/台湾台中讯) 全球内存领先供货商之一的华邦电子，今日宣布推出具有创新性的闪存产品系列─可叠积式<span class="match">SpiStack</span>®串口式闪存。此新产品 ─ <span class="match">SpiStack</span>® W25M系列是全球第一种可在标准8管脚封装内叠积同性质或不同性质的串口式闪存 (SpiFlash) 的产品，可以为各类应用领域的开发人员对存储程序代码或数据的不同需求提供最适合的容量组合方案。 W25M系列将继续采用开发人员熟悉的8管脚封装，并扩展串口式闪存不同的容量范围。除此之外，W25M的产品特性是支持标准多通道I/O、SPI接口及指令集。 美国华邦...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-introduces-first-spistack-in-8-Pin-packages.html?__locale=zh

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000011.html&level=1

(2021-07-07台湾台中讯)—全球半导体存储解决方案领导厂商华邦电子于今日宣布，正式确认华邦HyperRAM™ 和 <span class="match">SpiStack</span>® (NOR+NAND) 产品能够与瑞萨基于Arm® 内核的RZ/A2M 微处理器 (MPU) 搭配使用。华邦长期向瑞萨供应各类外部存储器，其中包括DRAM、NOR Flash和NAND Flash等嵌入式系统的主流内存产品，RZ/A2M的用户也因此受益。 瑞萨RZ/A2M微处理器适用于人机界面（HMI），尤其是带有摄像头的HMI应用。RZ/A2M还支持广泛应用于移动设备的移动产业处理器接口（MIPI），并配备了用于高速图像处理的动态可配置处理器（DRP）。...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-hyperram-and-spistack-and-renesas-rza2m-accelerate-embedded-ai-system.html?__locale=zh

华邦在单一封装中堆叠两个闪存芯片，其中一个芯片用于执行写入/擦除操作，而另一个芯片可同时执行读取操作，从而实现更好的OTA更新。 华邦<span class="match">SpiStack</span>配备一颗高容量且能快速写入的NAND闪存，可为多个ECU的OTA管理应用提供合适的解决方案。 (2021-12-23台湾台中讯) —全球半导体存储解决方案领导厂商华邦电子今日发表旗下<span class="match">SpiStack</span>®产品具有独特优势，可赋能汽车和物联网设备的OTA固件更新。OTA更新目前已成为汽车、物联网和工业应用的关键功能，而华邦提供的创新<span class="match">SpiStack</span>解决方案，在单个封装中堆叠两个闪存芯片，使两个芯片进行同时读写，帮助客户实现快速、可靠、无风险的OTA更新...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond_spistack_ota_automobile_iot_two_stacked_dies_faster_more_accurate.html?__locale=zh

华邦电子W25M161AW <span class="match">SpiStack</span>产品（8 mm×6 mm）提供可储存开机代码16Mb NOR Flash及1Gb NAND Flash给Linux®或其他操作系统使用。 （2019年8月6日加州圣克拉拉讯）- 全球半导体存储解决方案领导厂商华邦电子今日宣布其首创之<span class="match">SpiStack</span>® NOR+NAND 可堆栈式内存甫获恩智浦半导体FRWY-LS1012A开发板采用，以搭配该公司Layerscape® LS1012A 系列之通信处理器。 恩智浦半导体已将华邦电子之W25M161AW <span class="match">SpiStack</span> 产品纳入其新推出的FRWY-LS1012A 开发板设计中，其主要用以开发LS1012A...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/space_saving_winbond_nor_nand_dual_die_memory_supports_nxp_layerscape_ls1012a_.html?__locale=zh

https://www.winbond.com/productResource-files/Winbond%20SpiStack%20Flash%20Product%20Brief.pdf

Winbond is the first company to offer the new spistack W25M Memory Series for “stacking” of homogeneous or heterogeneous flash, thus achieving memories of varying densities for code and data storage, while providing designers with flash solutions most appropriate for their design requirements.

https://www.winbond.com/hq/hq/support/online-learning/video-item/video00012.html?__locale=zh

What is the simplest and quickest way to add "multi-layer authentication" into your existing designs? And what is <span class="match">SpiStack</span> Flash Memory? Why stacked die?

https://www.winbond.com/hq/hq/support/online-learning/video-item/video00003.html?__locale=zh

Winbond will introduce how faster erase and program capabilities of Winbond’s QspiNAND and <span class="match">SpiStack</span>® Flash can improve not only manufacturing throughput, thus lowering costs, but also provide better performance to address the growing popularity of OTA where typically a large amount of code or data i...

https://www.winbond.com/hq/hq/support/online-learning/webinars-item/webinars00006.html?__locale=zh