線上研討會
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線上研討會
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隨著嵌入系統發展到物聯網時代,對安全儲存的需求也日與聚增,過往封閉的系統則會面臨透過網路傳播的駭客和惡意軟體的攻擊。 W77Q為隨插即用的替代產品,可支援安全啟動、信任根與系統恢復力,並為操作系統如OTA更新和裝置驗證提供強健的防護。 講師: Itay Admon | System Architect at Winbond Secure Flash Division
信任根和遠端證明—W77Q (第三部份)
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Today’s embedded applications demand innovative non-volatile memory (NVM) solutions in order to meet the diverse requirement of connected platforms. As the largest supplier of serial NVMs, Winbond continues its broad application coverage by offering SpiStack, 1.2V flash, and Authentication memories. SpiStack combines the fast random access and XIP capability of NOR with the density and cost effectiveness of NAND in one small, low-pin-count SPI package. Such stack memory enables a system to have both fast boot as well as storage of large O.S. and application software. The recently introduced 1.2V flash delivers more than 1/3 reduction in energy consumption thus extending the battery life of coin cell operated IOT devices. The Authentication product portfolio provides scalable, secured memory solutions allowing system developers to utilize existing flash memory layout to harden system level security without additional hardware. Presenter: Jackson Huang | Senior Marketing Director
New Generation of Advanced Flash for Connected Platforms
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在此次的線上研討會中, 您將會了解… 新型W77Q安全快閃記憶體可望成為既有快閃記憶體裝置隨插即用式替代產品,並支援安全韌體更新,安全韌體存儲與安全啟動。 立即註冊觀看Security線上研討會。更多資訊或問題,歡迎洽詢: TrustME@winbond.com 講師: Itay Admon | System Architect at Winbond Secure Flash Division
W77Q 安全快閃記憶體 – 平台韌體安全 (第二部份)
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在此次的線上研討會中, 您將會了解… 新型W77Q安全快閃記憶體可望成為既有快閃記憶體裝置隨插即用式替代產品,支援安全啟動、信任根與恢復能力,並提供即時線上韌體更新 (OTA) 與裝置認證等強大的安全防護力。 立即註冊觀看Security線上研討會(八分鐘)。更多資訊或問題,歡迎洽詢: TrustME@winbond.com 講師: Itay Admon | System Architect at Winbond Secure Flash Division
W77Q 安全快閃記憶體 – 與標準快閃記憶體兼容、應用於互聯網的隨插即用式替代產品用於 (第一部份)
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In today’s connected world, there’s no denying that smart devices need reliable security. If you’re looking for a cost-effective memory with authentication, you’ll find everything you need in Winbond’s W74M memory devices. Built to offer comprehensive protection for IoT devices, these non-volatile memory products equips with multi-layered authentication to add a robust layer of security to IoT devices. The multi-layer authentication is accomplished with a “Challenge and Response” routine that involves the private root key and updated Monotonic Flash Counter value. Each W74M can provide authentication service up to four different hosts or systems to ensure that a product, consumables it uses, firmware it runs, accessories that support it and, the network nodes it connects to are not cloned or counterfeited. Presenter: CS Lin | Marketing Executive
How to add multi-layered authentication into your IoTs?
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Winbond will introduce how faster erase and program capabilities of Winbond’s QspiNAND and SpiStack® Flash can improve not only manufacturing throughput, thus lowering costs, but also provide better performance to address the growing popularity of OTA where typically a large amount of code or data is remotely updated... Presenter: Jackson Huang / Winbond Electronics Corporation America
Higher Manufacturing Throughput and Faster OTA with Winbond QspiNAND and SpiStack® Flash
技術文章
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有鑒於平板和智慧手機的普及化,大家都已經習慣在日常生活中,使用這些擁有炫麗螢幕和結合許多功能的裝置,...
全新問世: 華邦的高效能Serial NAND系列--一種為了高階汽車而生的高容量記憶體元件
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The use of semiconductor memory has grown and the ...
A prominent leader in the semiconductor memory technology segment: Winbond
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如何在AI終端應用中選擇合適的快閃記憶體
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隨著物聯網的興起,愈來愈多的新興應用開始競相嶄露頭角,如人工智慧、車聯網、以及愈來愈聰明的日常用品。...
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在今日,行動電話由於其可到處攜帶,且無任何時間使用限制之特性已經變成消費者最喜歡的裝置。雖然行動電話...
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隨著現今電子產品運用了越來越多的應用軟體,積體電路(IC)將需要越來越多的頻寬。為了達成這個目的,通...
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在汽車邁向數位化演進的過程中,將面臨越來越大量的資訊流傳遞、處理與儲存的需求。在各項應用過程當中,都...
電動車吹響數位化號角,快閃記憶體市場迎來酣戰
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近年來車用記憶體需求量呈現爆炸式的增長,其原因在於先進駕駛輔助系統(ADAS)技術逐漸成熟,乘客對於...
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如何透過堆疊晶片的技術解決快閃記憶體容量不足、減少晶片腳位數,以及降低系統設計的複雜度