Root-Of-Trustとリモートアテステーション（デバイス構成証明）- W77Q（Part 3）

本日のウェビナーでは、従来から使用されているシリアルNORフラッシュメモリをそのまま置換え可能な（Drop-In-Replacement）、新セキュアフラッシュメモリW77Qの紹介パート２をお届けします。W77Qの持つ、セキュアファームウェア更新、セキュアストレージ、セキュアブート機能を紹介します。 ご質問がございましたら　TrustME@winbond.com 　までお問い合わせください。   発表者: Itay Admon | System Architect at Winbond Secure Flash Division

本日のウェビナーでは、従来から使用されているシリアルNORフラッシュメモリをそのまま置換え可能な（Drop-In-Replacement）、新セキュアフラッシュメモリW77Qの紹介をします。W77Qは、セキュアブート、Root-Of-Trust、レジリエンシー、またOver-The-Airといったセキュアなファームウェア更新やデバイス認証機能をサポートします。ご質問がございましたら　TrustME@winbond.com 　までお問い合わせください。 発表者: Itay Admon | System Architect at Winbond Secure Flash Division  

In today’s connected world, there’s no denying that smart devices need reliable security. If you’re looking for a cost-effective memory with authentication, you’ll find everything you need in Winbond’s W74M memory devices. Built to offer comprehensive protection for IoT devices, these non-volatile memory products equips with multi-layered authentication to add a robust layer of security to IoT devices.  The multi-layer authentication is accomplished with a “Challenge and Response” routine that involves the private root key and updated Monotonic Flash Counter value. Each W74M can provide authentication service up to four different hosts or systems to ensure that a product, consumables it uses, firmware it runs, accessories that support it and, the network nodes it connects to are not cloned or counterfeited. Presenter: CS Lin | Marketing Executive

Today’s embedded applications demand innovative non-volatile memory (NVM) solutions in order to meet the diverse requirement of connected platforms. As the largest supplier of serial NVMs, Winbond continues its broad application coverage by offering SpiStack, 1.2V flash, and Authentication memories. SpiStack combines the fast random access and XIP capability of NOR with the density and cost effectiveness of NAND in one small, low-pin-count SPI package. Such stack memory enables a system to have both fast boot as well as storage of large O.S. and application software. The recently introduced 1.2V flash delivers more than 1/3 reduction in energy consumption thus extending the battery life of coin cell operated IOT devices. The Authentication product portfolio provides scalable, secured memory solutions allowing system developers to utilize existing flash memory layout to harden system level security without additional hardware. Presenter: Jackson Huang | Senior Marketing Director

Winbond will introduce how faster erase and program capabilities of Winbond’s QspiNAND and SpiStack® Flash can improve not only manufacturing throughput, thus lowering costs, but also provide better performance to address the growing popularity of OTA where typically a large amount of code or data is remotely updated... Presenter: Jackson Huang / Winbond Electronics Corporation America