信任根和遠端證明—W77Q (第三部份)

Today’s embedded applications demand innovative non-volatile memory (NVM) solutions in order to meet the diverse requirement of connected platforms. As the largest supplier of serial NVMs, Winbond continues its broad application coverage by offering SpiStack, 1.2V flash, and Authentication memories. SpiStack combines the fast random access and XIP capability of NOR with the density and cost effectiveness of NAND in one small, low-pin-count SPI package. Such stack memory enables a system to have both fast boot as well as storage of large O.S. and application software. The recently introduced 1.2V flash delivers more than 1/3 reduction in energy consumption thus extending the battery life of coin cell operated IOT devices. The Authentication product portfolio provides scalable, secured memory solutions allowing system developers to utilize existing flash memory layout to harden system level security without additional hardware. Presenter: Jackson Huang | Senior Marketing Director

在此次的線上研討會中, 您將會了解… 新型W77Q安全快閃記憶體可望成為既有快閃記憶體裝置隨插即用式替代產品，並支援安全韌體更新，安全韌體存儲與安全啟動。 立即註冊觀看Security線上研討會。更多資訊或問題，歡迎洽詢: TrustME@winbond.com   講師： Itay Admon | System Architect at Winbond Secure Flash Division

在此次的線上研討會中, 您將會了解… 新型W77Q安全快閃記憶體可望成為既有快閃記憶體裝置隨插即用式替代產品，支援安全啟動、信任根與恢復能力，並提供即時線上韌體更新 (OTA) 與裝置認證等強大的安全防護力。 立即註冊觀看Security線上研討會(八分鐘)。更多資訊或問題，歡迎洽詢: TrustME@winbond.com 講師: Itay Admon | System Architect at Winbond Secure Flash Division

In today’s connected world, there’s no denying that smart devices need reliable security. If you’re looking for a cost-effective memory with authentication, you’ll find everything you need in Winbond’s W74M memory devices. Built to offer comprehensive protection for IoT devices, these non-volatile memory products equips with multi-layered authentication to add a robust layer of security to IoT devices.  The multi-layer authentication is accomplished with a “Challenge and Response” routine that involves the private root key and updated Monotonic Flash Counter value. Each W74M can provide authentication service up to four different hosts or systems to ensure that a product, consumables it uses, firmware it runs, accessories that support it and, the network nodes it connects to are not cloned or counterfeited. Presenter: CS Lin | Marketing Executive

Winbond will introduce how faster erase and program capabilities of Winbond’s QspiNAND and SpiStack® Flash can improve not only manufacturing throughput, thus lowering costs, but also provide better performance to address the growing popularity of OTA where typically a large amount of code or data is remotely updated... Presenter: Jackson Huang / Winbond Electronics Corporation America