在线研讨会

Winbond will introduce how faster erase and program capabilities of Winbond’s QspiNAND and SpiStack® Flash can improve not only manufacturing throughput, thus lowering costs, but also provide better performance to address the growing popularity of OTA where typically a large amount of code or data is remotely updated...

Presenter:

Jackson Huang / Winbond Electronics Corporation America

随着嵌入系统发展到物联网时代，对安全储存的需求也日与聚增，过往封闭的系统则会面临通过网络传播的黑客和恶意软件的攻击。 W77Q为即插即用的替代产品，可支持安全启动、信任根与系统恢复力，并为操作系统如OTA更新和设备验证提供强健的防护。讲师： Itay Admon | System Architect at Winbond Secure Flash Division

信任根和远程程证明—W77Q (第三部份)
在此次的线上研讨会中, 您将会了解… 新型W77Q安全快闪记忆体可望成为既有快闪记忆体装置随插即用式替代产品，并支援安全韧体更新，安全韧体存储与安全启动。立即注册观看安全在线研讨会（八分钟）。更多资讯或问题，欢迎洽询： TrustME@winbond.com 讲师： Itay Admon | System Architect at Winbond Secure Flash Division

W77Q 安全快闪记忆体 – 平台韧体安全 (第二部份)
在此次的在线研讨会中, 您将会了解… 新型W77Q安全闪存可望成为既有闪存装置即插即用式替代产品，支持安全启动、信任根与恢复能力，并提供实时在线韧体更新 (OTA) 与装置认证等强大的安全防护力。立即注册观看安全在线研讨会（八分钟）。更多资讯或问题，欢迎洽询： TrustME@winbond.com 讲师: Itay Admon | System Architect at Winbond Secure Flash Division

W77Q 安全快闪记忆体 – 与标准快闪记忆体兼容、应用于互联网的随插即用式替代产品用于 (第一部份)
In today’s connected world, there’s no denying that smart devices need reliable security. If you’re looking for a cost-effective memory with authentication, you’ll find everything you need in Winbond’s W74M memory devices. Built to offer comprehensive protection for IoT devices, these non-volatile memory products equips with multi-layered authentication to add a robust layer of security to IoT devices. The multi-layer authentication is accomplished with a “Challenge and Response” routine that involves the private root key and updated Monotonic Flash Counter value. Each W74M can provide authentication service up to four different hosts or systems to ensure that a product, consumables it uses, firmware it runs, accessories that support it and, the network nodes it connects to are not cloned or counterfeited. Presenter: CS Lin | Marketing Executive

How to add multi-layered authentication into your IoTs?
Today’s embedded applications demand innovative non-volatile memory (NVM) solutions in order to meet the diverse requirement of connected platforms. As the largest supplier of serial NVMs, Winbond continues its broad application coverage by offering SpiStack, 1.2V flash, and Authentication memories. SpiStack combines the fast random access and XIP capability of NOR with the density and cost effectiveness of NAND in one small, low-pin-count SPI package. Such stack memory enables a system to have both fast boot as well as storage of large O.S. and application software. The recently introduced 1.2V flash delivers more than 1/3 reduction in energy consumption thus extending the battery life of coin cell operated IOT devices. The Authentication product portfolio provides scalable, secured memory solutions allowing system developers to utilize existing flash memory layout to harden system level security without additional hardware. Presenter: Jackson Huang | Senior Marketing Director

New Generation of Advanced Flash for Connected Platforms