Define new product specification based on market trend and customer requirements. Analyze new product trend from the market. Provide customers with new product definition, technical support, create technical documentation, assist in back-end product activities, validate new products and oversee third party programmer support for Winbond’s line of SpiFlash memory products. Create and manage Verilog and IBIS Model generation. Monitor and work with product engineer on Alpha test, Beta test, manage and report on results of early users and betas-sites. Compile and review characterization data with specifications. Compare competitors’ devices by characterization and validation. Identify problems and drive design engineer and product engineer to resolve issues.
Master’s degree in Electrical Engineering and three years of experience in embedded system and software applications including experience in C, C++, Linux, code management tools such as syn, ARM processors and ARM assembly coding, software debugger for flash development, logic analyzer and debugger for embedded systems, experience with BSP layer such as UBOOT, Bootloader, and CPU ROM code, understanding schematics and data sheets for driver development for SoC, experience in Verilog coding and circuit for digital IC design, flash market analysis, flash software implementation in application system, and sales with worldwide tier-one contract manufacturer.
Contact E-mail: RCARDINA@winbond.com Tel: 1-408-943-6666