Winbond Will Join FMS on Santa Clara Convention Center

[Event Information]

FMS: The Future of Memory and Storage is the premier international showcase for the memory and storage industry, featuring cutting-edge technologies, leading company keynotes, and extensive sessions on emerging solutions. The scope of FMS will include DRAM, DNA data storage, UCIe chiplet interconnects, Compute Express Link (CXL), wearables, automotive, AI/ML, data centers, and entertainment applications, along with 3D flash, NVMe, ZNS, and important industry announcements.

[Product Information]

You will find 3 product lines with its highlight products at Winbond booth.

• Code Storage Flash Memory
  
  • Firmware Update on Edge Computing Platform with QspiNAND
  • New 512Mb Octal NOR Flash with 400MB/s Data Throughput
  • 10G PON application with QspiNAND Flash
  • 1.8V OctalNAND operation up to 240MB/s data throughput

• Customized Memory Solution
  
  • LPDDR4 with Flex Logix InferX X1
  • 4Gb LPDDR4 with STM32 series
  • Efinix Titanium Ti60 with  HYPERRAM
  • Ambiq Apollo4 with  HYPERRAM

• TrustME®
  • W77Q can secure and protect the confidential and sensitive data on different applications, including OTA, IoT, POS and IIoT.

[Register]

For more information about Winbond product and demo, please come and visit us on booth 719. Click the link to register FMS!

About Winbond

Winbond Electronics Corporation is a total memory solution provider. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME^® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets. Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Winbond is a registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners.

Event contact
Yulia Lee
MarCom Manager
TEL: 886-3-5678168 Ext.75395
E-mail: YLLI5@winbond.com