Winbond Will Join FMS on Santa Clara Convention Center

[Event Information]

The Future of Memory and Storage is the premier international showcase for the memory and storage industry, featuring cutting-edge technologies, leading company keynotes, and extensive sessions on emerging solutions. The scope of FMS will include DRAM, DNA data storage, UCIe chiplet interconnects, Compute Express Link (CXL), wearables, automotive, AI/ML, data centers, and entertainment applications, along with 3D flash, NVMe, ZNS, and important industry announcements.

[Product Information]

You will find 3 product lines with its highlight products at Winbond booth.

• Code Storage Flash Memory
  • 1Gb Octal NAND Flash with 240 MB/s Data Throughput
  • 512Mb Octal NAND operation up to 240MB/s data throughput
  • Smart camera with SPI NOR Flash
  • QSPI NAND with NXP i.MX RT1176

• Customized Memory Solution
  • STM32 with 4Gb LPDDR4 
  • CUBE 4 Layer WOW hybrid bonding demostration

• TrustME®
  • W77Q can secure and protect the confidential and sensitive data on different applications, including OTA, IoT, POS and IIoT.
  • W77T Secure Solution for platform firmware resilience and Automotive functional safety on Sparrow Hawk 

[Register]

For more information about Winbond product and demo, please come and visit us on booth 719 !

About Winbond

Winbond Electronics Corporation is a total memory solution provider. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME^® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets. Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Winbond is a registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners.

Event contact
Yulia Lee
MarCom Manager
TEL: 886-3-5678168 Ext.75395
E-mail: YLLI5@winbond.com