Winbond Electronics Corporations in electronica 2012

  • Date:
    November 13 to 16, 2012
    New Munich Trade Fair Centre, Germany
    Hall A4 Booth 139

Winbond Electronics Corporation is attending the upcoming electronica 2012, 25th international trade fair (Booth No: A4.139) hosted by Messe Muenchen International(MMI) in Munich, Germany.  Winbond will join as a co-exhibitor with Atlantik Electronik GmbH, and the Products of Winbond Electronics Corporation are Flash Memory, Mobile RAM and Specialty DRAM, which are going to be promoted at the electronica 2012.

For more information about the electronica 2012, please visit: http://www.electronica.de/en/home



About Winbond

Winbond Electronics Corporation (TSE:2344) is a worldwide leading supplier of specialty memory. The Company provides total solution for low to medium density memory products backed by the expert capabilities of design, manufacturing, and sales services.

Winbond owns three main business groups: DRAM Product, NOR Flash and Memory IC Manufacturing. Winbond’s product portfolio, consisting of Mobile RAM, Specialty DRAM and low/medium-density NOR Flash, is widely used by leaders in the consumer, communication, computer peripheral and automotive markets. Based on a 300 mm wafer fab, Winbond keeps pace with the latest technologies to provide high-quality memory IC manufacturing services.

Winbond headquarters in Central Taiwan Science Park, Taiwan, and also has subsidiaries in America, Japan, China and Hong Kong. For more information, please visit: www.winbond.com


*Note: Winbond is a registered trademark of Winbond Electronics Corp. All other trademarks and copyrights mentioned herein are the property of their respective owners.

Event Contact
Jenny Chen
Sales Promotion Department
TEL: 886-3-5678168 #86333
E-mail: WCCHEN22@winbond.com

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