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Winbond Releases Multiple Key Chips and IC Design Technologies at 2007 eMEX Suzhou

  • Date:
    October 18 to 21, 2007
    Location:
    Suzhou International Expo Center(Expo Plaza, Suzhou Industrial Park)
    Booth:
    4I28, 4B Hall

Winbond Electronics Corp. will attend the upcoming 2007 eMEX, Suzhou, China. Winbond together with WTC Walsin PSA (Passive System Alliance) Group* will join eMEX to demonstrate our complete range of products. Multiple Winbond IC designs as well as new products will be on display at the Suzhou International Expo Center. Winbond’s product lines include Mobile RAM, Computer Logic IC, Flash Memory, and μC and μC-Based Consumer IC. Details of the products on display are:

Mobile RAM for Mobile Phones

Computer Logic IC & Flash Memory for Information Electronics

μC and μC-Based Consumer IC for Consumer and Automobile Electronics 

More information about 2007 eMEX, visit: http://www.goemex.com/

*Note: Walsin PSA (Passive System Alliance) Group includes Walsin Technology, Hannstar Display, HannStar Board, Walton Advanced Engineering , tMt (Touch Micro-system Technology), Kamaya, Prosperity Dielectrics, POE International and Frontier Electronics etc..

 


News Contact:
Erin Chou
Sales Promotion Dept.
TEL:886-3-5770066-1086
Email:chchou7@winbond.com

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