Winbond Electronics Corporation at GlobalPlatform Trusted Execution Environment (TEE) Conference 2015

Winbond Electronics Corporation is pleased to announce the participation in the upcoming GlobalPlatform Trusted Execution Environment (TEE) Conference 2015 as a Gold Sponsor. We sincerely invite you to come to visit us to learn more about Winbond’s innovative secure memory solutions, TrustME^TM: the world’s first Secure Flash device, certified to Common Criteria EAL5+, ideal for ePayments, Automotive, Industrial and Internet of Things (IoTs).  

For more information about GlobalPlatform Trusted Execution Environment (TEE) Conference 2015, please visit: http://www.teeseminar.org/

About Winbond

Winbond Electronics Corporation is a worldwide leading supplier of specialty memory IC’s. The company provides memory solution backed by the expert capabilities of design, manufacturing and sales services.

Winbond’s product portfolio, consisting of Mobile DRAM, Specialty DRAM and Code Storage Flash, is widely used by tier-1 customers in consumer, communication, computer peripheral and automotive markets. Our 300 mm wafer fab keeps pace with advanced process technologies to provide high-quality memory IC products.

The Company was established in September 1987 and listed on Taiwan Stock Exchange in 1995 with headquarter in Central Taiwan Science Park, Taichung, Taiwan. Winbond also has subsidiaries in China, Hong Kong, Israel, Japan and the US. For more information, please visit:www.winbond.com

Note: “Winbond” is registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners

Event Contact

Fely Krewell

Business Development Manager

TEL: 1-408-943-6666 #61705

E-mail: FKREWELL@winbond.com