Winbond Will Join electronica 2026 on Messe München

 [Event Information]

electronica 2026: electronica 2026 is a premier global trade show for the electronics industry, featuring innovations in automotive, AI, IoT, and industrial electronics, and uniting industry leaders to explore future trends and solutions. Winbond, in collaboration with PSA (Passive System Alliance) and Nuvoton, will jointly present the respective advancements—Winbond in memory and storage technology.

Winbond will showcase its latest products, demonstrating innovations designed to meet the evolving demands of the electronics industry.

[Product Information]

You will find 3 product lines with its highlight products at Winbond booth.

• Code Storage Flash Memory
  
  • Qualcomm SA8620P automotive platform featuring Winbond's high-performance Octal NOR Flash for Advanced Driver Assistance Systems (ADAS)
  • NXP i.MX RT1176 platform featuring Winbond's QSPI NAND Flash

•  Customized Memory Solution
  • STM32 Series featuring LPDDR4
  • HYPERRAM^TM with Ambiq Apollo 4

• TrustME®
  • W77Q can secure and protect the confidential and sensitive data on different applications, including OTA, IoT and POS.

[Register]

For more information about Winbond product and demo, please come and visit us on B5-360. Click the link to register electronica!

About Winbond

Winbond was established in September 1987 and listed on the Taiwan Stock Exchange in 1995. The company is headquartered at the Central Taiwan Science Park (CTSP) in Taichung, Taiwan, and operates two highly automated and intelligent 12-inch wafer fabs in Taichung and Kaohsiung. Winbond is committed to providing comprehensive integrated circuit solutions to customers worldwide, with major product lines including Code Storage Flash, Customized Memory Solution (CMS), and various logic IC solutions.

Winbond is a registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners.

Event Contact
Joanne Chen
Marcom Department Senior Marcom
TEL: 886-3-5678168 Ext.71217
E-mail: YHChen43@winbond.com