News - Winbond

Description

Date
Description Winbond Announces Monthly Revenue for January

Date 2021-02-08
Description Flex Logix pairs its InferX X1 AI inference accelerator with the high-bandwidth Winbond 4Gb LPDDR4X chip to Set a New Benchmark in Edge AI Performance

Date 2021-01-27
Description Gowin Semiconductor embeds 64Mb HyperRAM™ DRAM from Winbond to give space and power savings in its latest solution for AI edge computing

Date 2021-01-13
Description Winbond Announces Monthly Revenue for December

Date 2021-01-08
Description High performance and low power consumption give Winbond’s 1Gb, LPDDR3 DRAM the edge in Tsing Micro’s new AI image-processing SoC

Date 2020-12-16
Description Winbond Announces Monthly Revenue for November

Date 2020-12-08
Description New ASIL-D certificate boost safety and security credentials of Winbond’s W75F Secure Memory Element

Date 2020-11-11
Description Winbond Announces Monthly Revenue for October

Date 2020-11-09
Description Winbond wins 2020 ASPENCORE World Electronics Achievement Awards

Date 2020-11-09
Description Winbond Announces Monthly Revenue for September

Date 2020-10-11