News - Winbond

Description

Date
Description Winbond Announces Monthly Revenue for March

Date 2021-04-09
Description Complete new cloud-to-device solution gives proven way to implement secure over-the-air firmware updates in IoT devices

Date 2021-03-24
Description Winbond Electronics Corporation announced the capital expenditure for the 12-inch fab had obtained approval from the board of directors

Date 2021-03-16
Description Winbond Announces Monthly Revenue for February

Date 2021-03-08
Description Winbond Announces Monthly Revenue for January

Date 2021-02-08
Description Flex Logix pairs its InferX X1 AI inference accelerator with the high-bandwidth Winbond 4Gb LPDDR4X chip to Set a New Benchmark in Edge AI Performance

Date 2021-01-27
Description Gowin Semiconductor embeds 64Mb HyperRAM™ DRAM from Winbond to give space and power savings in its latest solution for AI edge computing

Date 2021-01-13
Description Winbond Announces Monthly Revenue for December

Date 2021-01-08
Description High performance and low power consumption give Winbond’s 1Gb, LPDDR3 DRAM the edge in Tsing Micro’s new AI image-processing SoC

Date 2020-12-16
Description Winbond Announces Monthly Revenue for November

Date 2020-12-08