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AN0000025 Migration Guide from W29N02GV to W29N02KV
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA01-AN0000025.html&level=1
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Winbond Launches 8Gb DDR4 DRAM Built on Advanced 16nm Process Technology for Industrial and Embedded Applications
News
TAICHUNG, Taiwan– 2025-12-03 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the release of its new 8Gb DDR4 DRAM, developed using Winbond’s in-house advanced 16nm process technology, delivering higher speed, lower power consumption, an...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2025_1203_winbond_8gb_ddr4_dram_16nm_industrial_embedded.html?__locale=en
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W66CP6NB/W66DP2NQ 4Gb/8Gb LPDDR4 WFBGA200 SDP/DDP Automotive preliminary datasheet_P01-002_20191216
Datasheet
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA00-W66CP6NB_1.html&level=4
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W66CQ6NB/W66DQ2NQ 4Gb/8Gb LPDDR4X WFBGA200 SDP/DDP Automotive preliminary datasheet_P01-002_20191216
Datasheet
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA00-W66CQ6NB_1.html&level=4
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W66CP6RB/W66DP2RQ 4Gb x16/8Gb x32 LPDDR4/LPDDR4X combo VFBGA100/TFBGA200 SDP/DDP datasheet A01-001_20241230
Datasheet
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA00-W66CP6RB.html&level=1
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Automotive W66CP6RB/W66DP2RQ 4Gb x16 / 8Gb x32 LPDDR4/LPDDR4X combo VFBGA100/TFBGA200 SDP/DDP datasheet A01-001_20250415
Datasheet
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA00-W66CP6RB_1.html&level=4
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Code Storage Flash Memory - SLC NAND Flash
SLC NAND Flash
Industry Standard Compatible SLC NAND Flash Family Winbond is offering a family of industry standard SLC NAND Flash memories to service the lower density code storage SLC NAND segment in the 1Gb to 8Gb density range. SLC NAND flash products are a direct drop-in replacement to equivalent products in ...
https://www.winbond.com/hq/hq/product/code-storage-flash-memory/slc-nand-flash/index.html?__locale=en
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Winbond Introduces Innovative CUBE Architecture for Powerful Edge AI Devices
News
TAICHUNG, Taiwan– 2023-09-27– Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, has unveiled a powerful enabling technology for affordable Edge AI computing in mainstream use cases. The Company’s new customized ultra-bandwidth elements (CUBE) enable memory...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2023_0927_winbond_innovative_cube_architecture_edge_ai.html?__locale=en
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Winbond Joins AI Expo 2024 - AIvolution
https://www.winbond.com/hq/about-winbond/news-and-events/events/product-promotion/Winbond-Joins-AI-Expo-2024-AIvolution
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Winbond Will Join Embedded World 2025
https://www.winbond.com/hq/about-winbond/news-and-events/events/product-promotion/Winbond-Will-Join-Embedded-World-2025
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Code Storage Flash Memory
Code Storage Flash Memory
The Code Storage Flash Memory family consists of NOR, NAND and TrustME® Secure Flash Memories. Winbond is the #1 supplier of Serial Flash products in the industry and is the largest unit supplier of NOR flash memories. In this SpiFlash® family, products range in densities from 512Kb through 1Gb most...
https://www.winbond.com/hq/hq/product/code-storage-flash-memory/index.html?__locale=en
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Customized Memory Solution - DDR/SDR
DDR/SDR
Winbond’s DRAM product portfolio is consisting of Mobile RAM and Specialty DRAM. Specialty DRAM, focusing on low and middle density, features characteristics of high performance and high speed and is widely used by leaders in the consumer, communication, computer peripheral, industrial, and automobi...
https://www.winbond.com/hq/hq/product/customized-memory-solution/ddr-sdr/index.html?__locale=en
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Winbond Electronics Launches a Series of Mobile Memory Products - LPDDR4X targeting at Niche Market
News
(TAICHUNG CITY, Taiwan –12 September, 2019)-With the driving force of new technologies such as artificial intelligence (AI), ultra-high-resolution display, 5G mobile communication, and IoT, various kinds of new applications are emerging. Advanced Driver-Assistance Systems (ADAS), Smart Speakers, 8K ...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-launches-a-series-of-lpddr4x-at-niche-market.html?__locale=en
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White Paper: Revolutionizing Edge AI Computing with CUBE
https://www.winbond.com/hq/support/online-learning/articles-item/White-Paper-Revolutionizing-Edge-AI-Computing-with-CUBE
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Product selection
Other
https://www.winbond.com/hq/hq/support/faq/technical/.content/faq/faq00001.html?__locale=en
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Keyword search results for “ 8Gb ”, 19 Matches


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