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Sales and Samples
Other
https://www.winbond.com/hq/hq/support/faq/sale/.content/faq/faq00001.html?__locale=en
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White Paper: Meeting the EU’s Radio Equipment Directive (RED) Cybersecurity Standards
https://www.winbond.com/hq/support/online-learning/articles-item/-White-Paper-Meeting-the-EUs-Radio-Equipment-Directive-RED-Cybersecurity-Standards
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How the architecture of new home security vision systems affects their choice of system memory technology
Customized Memory SolutionPSRAMDDR/SDRLPDDR/LPSDRKGDTechnical Article
A Camera or a Computer? AI and Machine Learning in Consumer Markets A long-forecast surge in the number of products based on artificial intelligence (AI) and machine learning (ML) technologies is beginning to reach mainstream consumer markets. It is true that research and development teams have foun...
https://www.winbond.com/hq/hq/support/online-learning/articles-item/how-new-home-security-vision-systems-affects-the-choice-of-system-memory-technology.html?__locale=en
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Winbond introduces the next generation 8Mb Serial Flash – W25Q80RV for low power and small form factor IoT devices
News
Taichung, Taiwan – 2023-06-15 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the 8Mb W25Q80RV, the first of a new 3V RV series flash devices capable of high performance, low power, and available in small-form-factor for addressing the ...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2023_0615_winbond_next_generation_8mb_serial_flash_edge_device_constrained_iot_applications.html?__locale=en
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Winbond’s leadership in Flash innovation continues with introduction of flexible new Sequential Read function in high-speed QspiNAND Flash
News
Latest 52MB/s QspiNAND products give users freedom to apply their preferred ECC software and data access configurations (Taichung, Taiwan – June 2, 2020) -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today extended its record of leading the industry...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-introduces-new-sequential-read-function-in-high-speed-qspinand-flash.html?__locale=en
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Winbond’s Secure Flash portfolio on show at electronica provides secure external storage for code and data in SoC- and processor-based systems
News
W75 and W77 series of Secure Flash devices protect data in connected and IoT devices from a wide range of hacking attacks and other security threats. W76 Secure Element provides certified solution for eUICC, mobile payments and other security-critical applications. Munich, Germany – 13 November, 201...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-secure-flash-at-electronica-provides-secure-external-storage-for-code-and-data-in-soc.html?__locale=en
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Winbond Introduces TrustME® Secure Flash Memory aligned with Platform Security Architecture from Arm
News
TAICHUNG, Taiwan – October 24, 2017 -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced an expansion of its TrustME® Secure Flash products portfolio aligned with Platform Security Architecture (PSA) from Arm. As the industry’s first Common...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-introduces-trustme-secure-flash-aligned-with-arm-psa.html?__locale=en
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Stakeholder Communication
Other
The relevance and precedence of stakeholders are identified by Winbond using the five principles of the AA1000 Stakeholder Engagement Standard (SES) 2015. These include Dependency, Responsibility, Influence, Tension, and Diverse Perspectives. Stakeholder analysis is carried out by Winbond every year...
https://www.winbond.com/hq/hq/about-winbond/csr-new/stakeholder-engagement/stakeholder-communication/index.html?__locale=en
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Winbond Introduces TrustME® Secure Flash Memory Implementing the Trusted Computing Group (TCG) Device Identifier Composition Engine (DICE) Architecture
News
TAICHUNG, Taiwan – October 24, 2017 -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced an expansion of its TrustME® Secure Flash products portfolio based on the Trusted Computing Group (TCG) Device Identifier Composition Engine (DICE) Arc...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-introduces-trustme-secure-flash-implementing-the-tcg-dice-architecture.html?__locale=en
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Winbond Embedded World 2019
https://www.winbond.com/hq/support/online-learning/video-item/Winbond-Embedded-World-2019
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Winbond launchs 32bit 32M/64Mb SDR/DDR KGD for SiP application
News
Winbond launchs 32bit 32M/64Mb SDR/DDR KGD for SiP application Winbond Electronics Corporation (WEC) today announced the launch of its latest 32bit bandwidth 32M/64Mb SDR / DDR DRAM memory which is built on its 65nm bWL process for SiP (System in Package) application. This new product is able to pro...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-launchs-32bit-sdr-ddr-kgd-for-SiP-application.html?__locale=en
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Winbond Electronics Corporations in electronica 2012
Event
Winbond Electronics Corporation is attending the upcoming electronica 2012, 25th international trade fair (Booth No: A4.139) hosted by Messe Muenchen International(MMI) in Munich, Germany. Winbond will join as a co-exhibitor with Atlantik Electronik GmbH, and the Products of Winbond Electronics Corp...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/events/product-promotion/promotion00004.html?__locale=en
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【Recap】IoT Security and Certification Schemes Workshop
https://www.winbond.com/hq/support/online-learning/video-item/Recap-IoT-Security-and-Certification-Schemes-Workshop
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[Re-scheduled] Winbond seminar- How innovation is bringing new value and new functionality to systems using code-storage Flash ICs
Event
Sorry, the seminar has been rescheduled and we will get back to you New Memory and Security Technologies for Designers of IoT Devices Designs for new connected devices of all types have to fulfil tough new requirements to succeed in a competitive market. In many cases, Internet of Things (IoT) edge ...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/events/product-promotion/promotion00019.html?__locale=en
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High Performance, Low Power, Small Form-factor Flash Memory for Next Generation Devices
https://www.winbond.com/hq/support/online-learning/articles-item/High-Performance-Low-Power-Small-Form-factor-Flash-Memory-for-Next-Generation-Devices
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