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Winbond Announces 512M bit mobile LPDDR & LPSDRAM for mobile display & mobile data communication application Winbond Announces New 512Mbit mobile LPSDRAM Mar/31/2011 512M mobile LPSDRAM W989D6C, W989D2C, Mobile LPSDR: 166MHz, respectively, supporting x16/x32 data widths W949D6C, W949D2C, Mobile LPDD...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-announces-512mb-mobile-lpddr-lpsdram-for-mobile-display-data-communication.html?__locale=en

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Winbond develops Mobile memory components with low power consumption, supporting not only smartphones and tablets but also extending to mobile consumer electronics and mobile communication applications. Winbond's Mobile DRAM devices support both x16 and x32 data bandwidths. The Mobile DRAM devices f...

https://www.winbond.com/hq/hq/product/customized-memory-solution/lpddr-lpsdr/index.html?__locale=en

MUNICH, Germany – 13 November 2018 -- Winbond Electronics Corporation is scheduled to present a new-generation ultra-low-power (ULP) DRAM at the 2018 electronica conference being held in Germany this November. The ultra-low power and high performance of this product make it particularly suitable for...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-reveals-a-new-ultra-low-power-mobile-dram-at-2018-electronica.html?__locale=en

https://www.winbond.com/hq/support/online-learning/articles-item/Redefining-Memory-for-AI-High-Bandwidth-Low-Latency-Solutions-for-Next-Gen-Computing

Winbond Electronics Corp. will attend the upcoming Electronics & Information Fair, Hangzhou, China 2007(eif) Exhibition hosted by the Taiwan Electrical and Electronic Manufacturers' Association (TEEMA), Hangzhou Municipal Government and Trade Development Bureau of Ministry of Commerce during Sep.5 t...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-launches-low-power-mobile-memory-in-2007-hongzhou-eif.html?__locale=en

Winbond is attending the 2008 IIC-China Shenzhen (Mar./3-4 Shenzhen Convention and Exhibition Center) & Shanghai (Mar./10-11 Shanghai Mart). We are glad to introduce Winbond's two new families of Mobile Memory components for mobile applications, Low Power DRAM and PSRAM that meet the increasing need...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-presents-low-power-mobile-memory.html?__locale=en

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