[Event Information]
Winbond Electronics will participate in the 2025 Embedded World Exhibition & Conference in Nuremberg, Germany, from March 11 to 13. This globally renowned event in the embedded systems industry brings together leading experts, industry professionals, and key associations, offering a unique opportunity to explore the latest advancements in embedded technology. The exhibition covers a wide range of topics, including components and modules, hardware and software design, M2M communication, services, and complex system design.
Leveraging its expertise in memory solutions, Winbond Electronics will showcase its cutting-edge memory technologies, providing developers, system architects, product managers, and technical leaders with valuable insights into innovative applications and future industry trends.
We invite you to visit Winbond Electronics at Booth 4A-635 to explore the latest technologies and join us in shaping the future of smart embedded systems!
[Product Information]
You will find 3 product lines with its highlight products at Winbond booth.
- Code Storage Flash Memory
- 1Gb OctalNAND Flash with 240MB/s data throughput
- Firmware update time comparison demo on edge computing platform - SPI NOR Flash vs QspiNAND Flash
- Automotive Octal NOR Flash can reach 400MB/s data throughput
- SPI NOR Flash for smart home application
- Customized Memory Solution
- STM32MP257 with 8Gb LPDDR4
- STM32H7R7 with HYPERRAM
- NXP i.MX8M plus with 200BGA 8Gb LPDDR4
- NXP i.MX935 with 100BGA 2Gb LPDDR4
- TrustME®
- W77Q complies with RED and EN 18031 to provide more comprehensive protection
- W77Q can secure and protect the confidential and sensitive data on different applications, including OTA, IoT and POS
[Embedded Forum]
Winbond Flash Memory and Custom Memory Solution will be featured in Embedded Forum. The details of the presentation are as follows. We welcome everyone to join us and learn about Winbond's latest products and solutions.
- Mar. 12 (Wed.) 12:00 pm ~ 12:30 pm UTC 01:00 @Hall 3
- Presenter: San-Ha Park, CMS Vice-President.
- Topic: Winbond Customized Memory for Your Smart Life
- Abstract:Winbond CMS specializes in delivering customized memory solutions. Each solution is optimized for specific applications, ensuring exceptional performance, reliability, and cost efficiency. By collaborating with professional suppliers, CMS ensures seamless system compatibility and peak performance.
- Mar. 13 (Thu.) 11:30 am ~ 12:00 pm UTC 01:00 @Hall 3A
- Presenter: William Chen, Flash Marketing Director.
- Topic: How to Balance System Energy Efficiency, Carbon Reduction, and Stability with Winbond’s new WQFN12
- Abstract : Designed for applications transitioning to 1.2V I/O while using a 1.8V Vcc, Winbond's new WQFN12 packaging provides a flexible pathway to lower power consumption and improved system stability, contributing to energy efficiency and carbon reduction. Winbond is committed to supporting customers the future transition to 1.2V solutions with dedicated products.
About Winbond
Winbond Electronics Corporation is a total memory solution provider. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets. Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.
Winbond is a registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners.
Event contact
Sophia Hsu
Digital Marketing Adminstrator
TEL: 886-3-5678168 Ext.78515
E-mail: YTHsu2@winbond.com