Winbond to present in NXP Connects China 2018

  • Date:
    September 5-6, 2018

Winbond was invited to present in NXP Connects China 2018, and delivered a speech titled “Memory Value in Future AIoT” to unfold the potential of memory in the AIoT application.



About Winbond

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions, headquartered in Taichung, Taiwan. Winbond’s major products include Specialty DRAM, Mobile DRAM, and Code Storage Flash Memory with Winbond’s memory business revenues in 2017 about US$1.25 billion. Winbond has approximately 2,800 employees worldwide, with offices in Taiwan, Hong Kong, China, Japan, Israel, and the USA. For more information, please visit: www.winbond.com.


Note: winbond LOGO is a registered trademark of Winbond Electronics Corp. All other trademarks and copyrights mentioned herein are the property of their respective owners


Event Contact
Joanne Chen
Sales Promotion Department
TEL: 886-3-5678168 #76744
E-mail: yhchen43@winbond.com.tw

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