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Date：November 11 to 14, 2014Location：New Munich Trade Fair CenterBooth：Hall A6 Booth 570/3.
Date : 2014/11/11-2014/11/14
Location : New Munich Trade Fair Center
Booth : Hall A6 Booth 570/3.
Winbond Electronics Corporation is attending the upcoming electronica 2014, 26th international trade fair in Munich, Germany. Come to visit us to learn more about Winbond’s memory solutions for Automotive, Industrial and Internet of Things (IoT).
For more information about the electronica 2014, please visit: http://www.electronica.de/en/home ( Booth No: A6.570/3)
About Winbond
Winbond Electronics Corporation is a worldwide leading supplier of specialty memory IC’s. The company provides memory solution backed by the expert capabilities of design, manufacturing and sales services.
Winbond’s product portfolio, consisting of Mobile DRAM, Specialty DRAM and Code Storage Flash, is widely used by tier-1 customers in consumer, communication, computer peripheral and automotive markets. Our 300 mm wafer fab keeps pace with advanced process technologies to provide high-quality memory IC products.
The Company was established in September 1987 and listed on Taiwan Stock Exchange in 1995 with headquarter in Central Taiwan Science Park, Taichung, Taiwan . Winbond also has subsidiaries in China, Hong Kong, Israel, Japan and the US. For more information, please visit: www.winbond.com
*Note: Winbond is a registered trademark of Winbond Electronics Corp. All other trademarks and copyrights mentioned herein are the property of their respective owners
Event Contact
Jenny Chen
Sales Promotion Department
TEL: 886-3-5678168 #86333
E-mail: WCCHEN22@winbond.com