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Date：2024 Nov, 12-15Location：Messe München, GermanyBooth：A5-153
[Event Information]
electronica 2024: electronica 2024 is a premier global trade show for the electronics industry, featuring innovations in automotive, AI, IoT, and industrial electronics, and uniting industry leaders to explore future trends and solutions. Winbond, in collaboration with PSA (Passive System Alliance), will jointly present the respective advancements—Winbond in memory and storage technology.
Winbond will showcase its latest products, demonstrating innovations designed to meet the evolving demands of the electronics industry.
[Product Information]
You will find 3 product lines with its highlight products at Winbond booth.
- Code Storage Flash Memory
- Firmware update time comparison demo on edge computing platform - SPI NOR Flash vs QspiNAND Flash
- New 512Mb Octal NOR Flash with 400MB/s data throughput
- 1.8V 2Gb Serial NOR Flash memory
- 1.8V OctalNAND Flash operation max. CLK is DDR 120MHz
- Customized Memory Solution
- DDR3L and DDR4 with STM32 series
- HYPERRAMTM with Efiniz® Titanium Ti60 F100
- 4Gb LPDDR4 with Mobileye EyeQ4H for ADAS application
- TrustME®
- W77Q can secure and protect the confidential and sensitive data on different applications, including OTA, IoT and POS.
[Register]
For more information about Winbond product and demo, please come and visit us on A5-153. Click the link to register electronica!
About Winbond
Winbond Electronics Corporation is a total memory solution provider. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets. Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.
Winbond is a registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners.
Event Contact
Joanne Chen
Marcom Department Senior Marcom
TEL: 886-3-5678168 Ext.71217
E-mail: YHChen43@winbond.com