Taichung, Taiwan – 2023-06-15 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the 8Mb W25Q80RV, the first of a new 3V RV series flash devices capable of high performance, low power, and available in small-form-factor for addressing the requirement of connected IoT edge devices used in industrial and consumer segments.
As IoT devices become widely deployed in industrial factory automation and smart home control applications combining processing, connectivity, and sensor technologies in a system that is small and upgradeable, the demand grows for flash memories that come in small-form-factor packaging, consume a negligible amount of energy, and support fast software updates.
The W25Q80RV is manufactured in Winbond’s own 12-inch wafer foundry utilizing the latest generation of Winbond’s 58nm technology. The die area is reduced by 40% compared to its predecessor which was built with 90nm technology. In addition to small-form-factor packaging, this new flash is suitable for space-constrained applications where the flash KGD or WLCSP is combined with the SoC in a System-In-Package.
With read speed improved from 104MHz to 133MHz, page programming time slashed by 50%, and active read current reduced by up to 20%, system functions are significantly optimized. XIP (eXecute-In-Place) of code is accomplished at a higher frequency, enabling greater system response while consuming less energy. Faster programming accelerates factory throughput and lowers manufacturing costs. The short time it takes to conduct an OTA firmware update means greater system availability and less downtime which can result in superior end-user experience. Along with a reduced form factor this new 8Mb flash supports new use cases for a range of IoT devices with higher performance, lower power, and faster manufacturing programming and OTA update.
The company has been supporting the requirements of customers using the 8Mb flash with the existing generation of W25QxxDV series for many years in applications including instrumentation, networking, PC, printer, automotive, and gaming. Now the time has come to support the latest versions of these IoT devices with advanced system capabilities. After the introduction of this new and improved 8Mb flash, the rest of the low-density RV series will be launched in the coming quarters, enabling migration from W25QxxCV and W25QxxDV series to their W25QxxRV counterparts.
The W25Q80RV supports all common single/dual/quad/QPI commands and read modes for XIP and code shadowing to RAM. This device operates on a single 2.7V to 3.6V power supply with a power-down current down to 1μA. Active read current is optimized from 12mA down to 10mA at 104MHz.
This 8Mb (1MB) flash is sectioned into 64KB or 32KB blocks and is further subdivided into small 4KB sectors which allow for greater flexibility and storage efficiency in applications that require code, data, and parameter storage in the same device. It is also capable of 66MHz Double Data Rate operation enabling the system to achieve the same high speed (133MHz Single Data Rate) read throughput at a lower clock frequency. The Read Command Bypass Mode supports faster memory access for true XIP operation by eliminating the command input cycle.
“Winbond is proud and committed to innovate and differentiate by designing our Serial Flash KGD and WLCSP solutions for use in specialized applications requiring non-volatile storage that is small in form factor, high speed, and energy efficient,” said Jackson Huang, Flash Product Marketing Vice President, Winbond. “We continue to work closely with customers and partners to add value to their next-generation embedded solutions.”
W25Q80RV is available now and will be followed by other densities in the family. For specific details, please visit www.winbond.com.
About Winbond
Winbond Electronics Corporation is a total memory solution provider. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets. Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.
Winbond is a registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners.
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