News - Winbond

Description

Date
Description Winbond announced 1H’22 Business Results

Date 2022-08-05
Description Winbond’s LPDDR4/4X 100BGA achieves JEDEC standard for improved energy conservation and carbon reduction in a smaller package size

Date 2022-07-27
Description Winbond Announces Monthly Revenue for June

Date 2022-07-08
Description Winbond Announces Monthly Revenue for May

Date 2022-06-07
Description Winbond TrustME® W77Q Secure Flash Obtains SESIP Level 2 with Physical Attacker Resistance Certification

Date 2022-05-31
Description Winbond Announces Monthly Revenue for April

Date 2022-05-10
Description Winbond Keeps Expanding DDR3 SDRAM Production

Date 2022-04-20
Description Winbond & Infineon Technologies Collaborate to Double Bandwidth for IoT Applications with HYPERRAM 3.0

Date 2022-04-14
Description Winbond Announces Monthly Revenue for March

Date 2022-04-08
Description Winbond extends code storage capacity of its ultra-low power 1.2V SPI NOR Flash family with launch of new 64Mb part

Date 2022-03-16