Winbond - News

Description

Date
Description Winbond Electronics Corporation Secured an NT$42 Billion 7-year Syndication Loan Agreement

Date Mon Jan 14 16:52:03 CST 2019
Description Winbond Announces Monthly Revenue for December

Date Tue Jan 08 17:09:32 CST 2019
Description Winbond collaborate with DNP for the large density memory eSIM and Secure Element Development

Date Fri Dec 07 17:20:00 CST 2018
Description Winbond Announces Monthly Revenue for November

Date Fri Dec 07 17:20:00 CST 2018
Description Winbond announces new 64Mbit addition to ultra-low power 1.2V family of SpiFlash memory products

Date Tue Nov 13 16:30:00 CST 2018
Description Winbond’s Secure Flash portfolio on show at electronica provides secure external storage for code and data in SoC- and processor-based systems

Date Tue Nov 13 16:30:00 CST 2018
Description Winbond and Tiempo Secure join forces to offer the world’s first fully CC EAL5+ certifiable Secure Element IP for IoT

Date Tue Nov 13 16:29:00 CST 2018
Description Winbond to reveal a new-generation Ultra-Low-Power Mobile DRAM solution at the 2018 electronica conference

Date Tue Nov 13 16:28:00 CST 2018
Description Winbond Announces Monthly Revenue for October

Date Wed Nov 07 17:20:00 CST 2018
Description Winbond announced 3Q’18 Business Performance Results

Date Mon Oct 29 17:23:49 CST 2018