Milestones - Winbond

Date

Milestones
Date 2024/08

Milestones Mass production of DRAM product with self-developed 25Snm process technology.
Date 2024/07

Milestones Successful verification of NOR Flash product with self-developed 45nm process technology
Date 2024/07

Milestones Successful verification of NOR Flash product with self-developed 45nm process technology.
Date 2023/09

Milestones Winbond introduces innovative CUBE architecture for powerful edge AI devices
Date 2023/08

Milestones Mass production of DRAM product with self-developed 20nm process technology.
Date 2023/07

Milestones Successful verification of NOR Flash product with self-developed 45nm process technology.
Date 2023/03

Milestones Winbond Group Recognized as a “Top 100 Global Innovator 2023”.
Date 2022/12

Milestones Kaohsiung Fab has passed the verification for quality system and international standards for environment, safety, and health. The first batch of self-developed 25Snm DRAM products, with the first 4G DDR3 product shipped in September, achieved qualification and entered into mass production in December.
Date 2022/11

Milestones Winbond won “Corporation Comprehensive Performance - Top 100 Taiwanese Companies Sustainability Awards”, “Corporate Sustainability Report - IT & IC Manufacturing Platinum Award”, and “Best Sustainability Practice Awards - Talent Development Leadership Award” in the Taiwan Corporate Sustainability Awards (TCSA) 2022.
Date 2021/12

Milestones Kaohsiung Fab received Building Use Permit and Fab Certificate.