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Corporate Officers

  • Arthur Yu-Cheng Chiao

    Chairman & CEO

    • Education
      • MS/ Major-Electrical Engineering/ University of Washington
      • BS/ Major-Telecommunication Engineering/ National Chiao Tung University
    • Major Experience
      • Chairman, Walsin Lihwa Corp.
  • Tung-Yi, Chan

    Vice Chairman & Deputy CEO

    • Education
      • Ph.D. / Major-Electrical Engineering / University of California, Berkeley, USA
      • MS / Major-Electrical Engineering / University of California, Berkeley, USA
      • MS / Major-Management Science / Stanford University
      • BS / Major-Electrical Engineering / National Taiwan University
    • Major Experience
      • President, Winbond Electronics Corp.
      • CEO, BCD Semiconductor
      • Vice President of Sales Center, Winbond Electronics Corp.
      • Technology Executive, Winbond Electronics Corp.
      • President, Winbond Electronics Corp. America
      • AVP of Product Center III, Winbond Electronics Corp. America
      • Director of Research and Development Division I, Winbond Electronics Corp. America
      • Technology Manager, Siliconix
      • Technology Manager, Cypress
      • Senior Engineer, Intel
  • Pei-Ming Chen

    President

    • Education
      • EMBA / Major-Business Administration  / National Taiwan University
      • MS / Major-Electrical Engineering / Detroit University
      • BS / Major-Electrical Engineering / National Cheng Kung University
    • Major Experience
      • Chairman, Nuvoton Technology Corp.
      • Vice President of DRAM Product Business Group, Winbond Electronics Corp.
      • Vice President of Sales Center, Winbond Electronics Corp.
  • Pei-Lin Pai

    CTO of Advanced Technology Development Group

    • Education
      • Ph.D. / Major-Electrical Engineering / University of California, Berkeley, USA
      • MS / Major-Electrical Engineering / University of California, Berkeley, USA
      • BS / Major-Electrical Engineering / National Taiwan University
    • Major Experience
      • Vice President of Technology R&D Group, Winbond Electronics Corp.
      • Vice President of Embedded Memory Business Group, Winbond Electronics Corp.
      • Vice President of Focal Tech Corp.
      • Vice President of Nanya Technology Corp.
      • President of Ascend Semiconductor Corp.
      • Marketing Director of Vanguard International Semiconductor Corp.
      • Engineering Vice President of Omega Micro Technologies, Inc.
      • Engineering Manager of Cypress Semiconductor Corp.
      • Senior Engineer, Intel.
  • Hsiang-Yun Fan

    Vice President of DRAM Product Business Group

    • Education
      • MBA / Major- Business Administration / National Chung Cheng University
    • Major Experience
      • Vice President of General Administration Center, Nuvoton Technology Corp.
  • Wen-Hua Lu

    Vice President of Memory IC Manufacturing Business Group

    • Education
      • MS / Major-Materials Science and Engineering / National Taiwan University
      • BS / Major-Chemical Engineering / National Tsing Hua University
    • Major Experience
      • Executive of Memory IC Manufacturing Business Group, Winbond Electronics Corp.
      • Executive of Kaohsiung Fab. Construction Planning Task Force, Winbond Electronics Corp.
      • Assistant Vice President of DRAM Product Marketing Center, Winbond Electronics Corp.
      • Assistant Vice President of 300mm Memory Product Manufacturing Center, Winbond Electronics Corp.
      • Director of 300mm Module Engineering Division, Winbond Electronics Corp.
  • Jen-Lieh Lin

    Vice President of Flash Memory IC Business Group

    • Education
      • MS / Major-Materials Electrical Engineering / National Cheng Kung University
    • Major Experience
      • Vice President of Microcontroller Application Business Group, Nuvoton Technology Corp.
      • Assistant Vice President of Microcontroller Product Center, Nuvoton Technology Corp.
      • Assistant Vice President of System Technology Center, Winbond Electronics Corp.
      • Director of Micro Controller R&D Division, Winbond Electronics Corp.
  • Jing-Fong Tsai

    Vice President of Quality and ESH Center

    • Education
      • Ph.D. / Major-Materials Science and Engineering / University of Utah, SLC, Utah, USA
      • MS / Major-Materials Science and Engineering / National Tsing Hua University
      • BS / Major- Metallurgy and Materials Engineering / National Cheng Kung University
    • Major Experience
      • Vice President of Sales Center, Winbond Electronics Corp.
      • Vice President of Technology and Chief Technology Officer, General Electronic Materials Corporation
      • Vice President, Eversol Corporation
      • Deputy director of QRA, United Microelectronics Corporation
      • Quality assurance supervisor, Phoenix Silicon International Corporation
      • Technical manager, Monsanto Electronic Materials Company
      • Senior process engineer, National Semiconductor Corporation
      • Research & development engineer, Metal Industries Research & Development Center
  • Wen-Chang Hung

    Vice President of Sales Center

    • Education
      • MS / Major-Industrial Engineering and Systems Management / Chung Hua University
      • BS / Major-Industrial Engineering and Systems Management / Feng Chia University
    • Major Experience
      • Assistant Vice President of Sales Center, Winbond Electronics Corp.
      • Assistant Vice President of Flash Product Marketing Center, Winbond Electronics Corp.
      • Assistant Vice President of DRAM Product Marketing Center, Winbond Electronics Corp.
      • President, Winbond Electronics Ltd. Hong Kong
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