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Multi-Chip Package (MCP) memory product family consists of a 1.8V NAND Flash Memory device combined with a 1.8V Low Power SDRAM device in one package to provide the most space effective solution for saving area on the PCB (Printed Circuit Board). This benefit becomes more critical in small PCBs for modules and space critical designs particularly for mobile and portable applications.

Own DRAM and SLC NAND Flash Technology

Winbond Electronics Corp. is a Memory IC Company engaged in DRAM & Flash design, manufacturing and sales services. From product design, research and development, wafer fabrication to marketing of brand name products, Winbond endeavors to provide its global clientele top quality of low to medium density memory solutions.

Own 12-inch Fab

Winbond specializes in the design of high-performance, low-power memory, and riding on the strength of having a 12-inch fab, offers a whole series of SLC code storage NAND flash memory and Mobile DRAM products. Our in house wafer fabrication provides customers with full commitment in capacity support as well as delivery flexibility.

Longevity Support

Winbond Electronics Corporation, a longtime provider of memory semiconductors, is now offering a Winbond Product Longevity Program (WPLP) for applications that require long-term support which offers stability and longevity for long-life applications that need support for 5+ to 10 years.

Density

Ball Package Size(mm) MCP Part Number Density I/O Bus DRAM Type Automotive Status Datasheet
Flash DRAM Flash DRAM
162 8x10.5x1.0 W71NW10HM3FW 1Gb 1Gb 8 32 LPDDR2 - P Contact us
162 8x10.5x1.0 W71NW10HF3FW 1Gb 1Gb 8 32 LPDDR2 - P Contact us
162 8x10.5x1.0 W71NW10HE3FW 1Gb 512Mb 8 32 LPDDR2 - P Contact us
162 8x10.5x1.0 W71NW20KM3FW 2Gb 1Gb 8 32 LPDDR2 - S Contact us
162 8x10.5x1.0 W71NW20KJ3FW 2Gb 2Gb 8 32 LPDDR2 - S Contact us
162 8x10.5x1.0 W71NW20GF3FW 2Gb 1Gb 8 32 LPDDR2 - P Contact us
162 8x10.5x1.0 W71NW10GF3FW 1Gb 1Gb 8 32 LPDDR2 - N Contact us
162 8x10.5x1.0 W71NW10GE3FW 1Gb 512Mb 8 32 LPDDR2 - N Contact us
121 8x8x0.8 W71NW11GF1EW 1Gb 1Gb 16 16 LPDDR2 - P Contact us
121 8x8x0.8 W71NW11GE1EW 1Gb 512Mb 16 16 LPDDR2 - P Contact us
Status1:P= Mass Production, S(Time)=Samples(Ready Time), UD (Time)= Under Development(Ready Time), N=Not Recommended For New Design, EOL=End of life.
Status2:All winbond Flash products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.

Solution

Technical Documentation

Resources

Video

Winbond Embedded World 2018_Flash Memory

  • File Type:Video
  • Updated:26/06/2018
Video

Winbond embedded world 2018_Flash Memory Highlight

  • File Type:Video
  • Updated:26/06/2018
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