Winbond’s Multi-Chip Package (MCP) memory product family consists of a 1.8V NAND Flash Memory device combined with a 1.8V Low Power SDRAM device in one package to provide the most space effective solution for saving area on PCBs (Printed Circuit Boards).
One of the benefits of NAND flash is its non-volatile storage of data, NAND memory retains data even when the power is off. This benefit becomes more critical in small PCBs for modules and space critical designs particularly in mobile and portable applications.
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Own DRAM and SLC NAND Flash Technology
Winbond Electronics Corp. is a Memory IC Company engaged in DRAM & Flash design, manufacturing and sales services. From product design, research and development, wafer fabrication to marketing of brand name products, Winbond endeavors to provide its global clientele top quality of low to medium density memory solutions.
Own 12-inch Fab
Winbond specializes in the design of high-performance, low-power memory, and riding on the strength of having a 12-inch fab, offers a whole series of SLC code storage NAND flash memory and Mobile DRAM products. Our in house wafer fabrication provides customers with full commitment in capacity support as well as delivery flexibility.
Longevity Support
Winbond Electronics Corporation, a longtime provider of memory semiconductors, is now offering a Winbond Product Longevity Program (WPLP) for applications that require long-term support which offers stability and longevity for long-life applications that need support for 5+ to 10 years.
