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Winbond to Join in Fujitsu-Toshiba DRAM Development Program

(Taipei News) Fujitsu Limited, Toshiba Corporation and Winbond Electronics Corp. today announced that Winbond will join their collaborative development program for next-generation memory devices. Begun in January 1999, the 30-plus-billion-yen project has pursued development of 0.13ľm DRAM technology for next-generation ULSIs. With Winbond’s participation in this program, development will be pushed to cover 0.11ľm process technology. The companies aim to fabricate a 0.13ľm stacked 1giga-bit (Gb) DRAM by the end of 2001, and follow up with a 0.11ľm 1Gb DRAM by end of 2002. 

While DRAMs remain a key product, both in their own right and as a technology driver, intense price competition has eroded profit levels for manufacturers in recent years. Recognizing that future competitiveness lies in early breakthroughs supporting finer levels of process technology, Fujitsu, Toshiba and Winbond, technology leaders in DRAM, decided to collaborate in developing 0.13 and 0.11ľm-level process technology and the 1Gb generations of DRAM they can support. Moreover, the companies believe that any joint advances in major DRAM technologies may also find applications in System LSIs, microprocessors and a wide range of other semiconductor areas beyond memory devices. 

Under the agreement announced today, approximately 30 Winbond engineers will join the 100 Toshiba and Fujitsu engineers already engaged in development work at Toshiba’s Advanced Microelectronics Center (AMC) in Yokohama. They will participate in development of 0.13 and 0.11ľm process and device technology, including design and trial production of 1Gb DRAM. 

The participation of Winbond in the project will bring additional resources to bear on achieving technical advances, and will shorten the development term and enhance the program through a broader sharing of development costs and resources that reduces the overall burden on each participant. This collaboration project reflects Fujitsu, Toshiba and Winbond’s on-going commitment to developing advanced LSI technologies and supports the company’s strategic initiative to expand technology efforts. 



About Fujitsu Limited

Fujitsu Limited (TSE: 6702) is a leading provider of comprehensive information technology and network solutions for the global marketplace. Comprising over 500 group companies and affiliates worldwide -- including ICL, Amdahl and DMR Consulting Group -- the Fujitsu Group had consolidated revenues of 5.24 trillion yen ($43.3 billion) in the fiscal year ended March 31, 1999. With world-class hardware and software technology in computers, telecommunications and microelectronics, and a corps of 55,000 systems and services experts around the world, Fujitsu is uniquely positioned to harness the power of the network to help its customers succeed. Altogether, the Fujitsu Group has 188,000 employees and operations in over 100 countries. Homepage: http://www.fujitsu.co.jp/en/ 

Press Contacts: 
Isao Hirano, Bob Pomeroy, Scott Ikeda
Fujitsu Limited, Public Relations 
Tel: +81-3-3215-5236 (Tokyo) 
Fax: +81-3-3216-9365 
e-mail: pr_mailbox@hq.fujitsu.co.jp 



About Toshiba Corporation 
Toshiba Corporation is a leader in information and communications systems, electronic components, consumer products, and power systems. The company’s integration of these wide-ranging capabilities assures its position as a leading company in semiconductor, LCD and other electronic devices. Toshiba has 198,000 employees worldwide and annual sales of over $50 (US) billion. Visit Toshiba’s website athttp://www.toshiba.co.jp 

Press Contacts: 
Kenichi Sugiyama 
Toshiba Corporation Corporate Communications Office 
Tel: +81-3-3457-2105 
Fax: +81-3-5444-9202 
e-mail: press@toshiba.co.jp 



About Winbond Electronics Corp. 
Winbond Electronics Corporation is the largest branded IC company in Taiwan. Winbond's product portfolio covers PC and peripheral-related ICs, consumer electronics ICs, multimedia ICs, non-volatile memory and DRAMs. Winbond has a leading position in Taiwan and East Asia in telephone dialers, PC I/O controllers, speech synthesizers and MPEG decoders. Winbond has four wafer fabs in operation, with current technologies up to 0.175ľm. Winbond also provides certain wafer capacity to serve foundry customers. Winbond is based in Hsinchu Science-Based Park, Taiwan, and has sales offices in Taipei, Hong Kong and San Jose, California.




Spokesperson
    Wilson Wen
    Vice President of Administrative Center
    Tel:03-5792755

News Liaison
    Mike Liu
    Deputy Director
    Tel:03-5792516
    Email:ckliu@winbond.com

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