Winbond Electronics Corporation Licenses Mobile-FCRAM from Fujitsu

(Hsin-Chu, Taiwan)Winbond Electronics Corporation today announced a ground breaking licensing agreement with Fujitsu Limited for developing Fast Cycle Random Access Memory (FCRAM)technology. The agreement involves Fujitsu licensing its proprietary 32M Mobile-FCRAM to Winbond. In return, Winbond, the first FCRAM licensee in Taiwan, will provide Fujitsu with foundry services in support of Fujitsu'growing FCRAM product business. The development schedule calls for volume production from first quarter, 2002.

Fujitsu is leader in the field of low power DRAM architecture, and a pioneer in FCRAM technology. This technology revolutionizes the memory cell array-operating scheme that has been used industry-wide for the past 20 years. The radically new memory architecture can achieve full compatibility of a low power SRAM with only a fraction of chip size of a conventional 6T SRAM. This makes Mobile-FCRAM devices suitable for applications where long-duration battery operation is crucial such as mobile phone applications.

"Fujitsu Limited is a leader in specialty DRAM market. This collaboration constitutes a significant milestone in Winbond's strategy to team with world-class leaders and provide total solutions in our memory product portfolio."said Dr. Alex Wang, Corporate Vice President and General Manager of Winbond's Memory IC Business Group."The agreement will enable us to offer the industry Mobile- FCRAM devices functioning as low power SRAM for cellular phone application; a solution that complements Winbond's development of 64Mbit and derivative NOR Flash for handset and other applications. Winbond has a successful history of collaborating with Fujitsu and we look forward to working together for our continued mutual success." Dr. Wang noted.

In April 2000, Winbond joined Fujitsu Limited and Toshiba Corporation in a joint technology program aimed at developing next-generation memory device process technology for ULSIs. That on-going joint development project involves fabricating 0.13-micron stack capacitor 512 Mb DRAM and 0.11-micron 1 G-bit DRAM using innovative new process technology.

"This new agreement marks another step in Fujitsu's FCRAM, which targets the fast growing mobile markets to which the low cost and high-quality Mobile-FCRAM devices offer ideal solutions."said Masao Taguchi, General Manager of Memory LSI of Fujitsu Limited."As our strategic partner, Winbond's low cost and high-quality manufacturing expertise will enable us to bring more competitive solutions to market."



About Winbond

Winbond Electronics Corporation was founded in 1987 and is based in Hsinchu Science-Based Park, Taiwan. It has since become the largest branded IC company in Taiwan, offering a broad range of PC and peripheral-related ICs, consumer electronics ICs, multimedia ICs, and memory ICs. Winbond is a market leader in the telephone dialer, PC I/O controller, memory, speech synthesizer and MPEG decoder markets. With four wafer fabs currently in operation, the company utilizes process technologies ranging from 1.0 micron down to 0.175 micron. Winbond has more than 4,500 employees worldwide, with design centers located in Hsinchu, Taiwan; Shanghai, China; San Jose, California; Austin, Texas; and Herzliya, Israel.



Note:Winbond is registered trademark of Winbond Electronics Corporation. FCRAM is a trademark of Fujitsu Limited in Japan. All other company and product names mentioned herein may be trademarks or registered trademarks of their respective holders and are used for identification purpose only. 

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