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Winbond Appointed Mr. Tung-Yi Chan as President

(Taipei News) Winbond Electronics Corporation today announced the appointment of Mr. Tung-Yi Chan as President of Winbond which has been approved by the Board of Directors in the meeting held on February 6, 2009. The Board approved this designation, effective February 9, 2009, in recognition of Mr. Cheng’s past achievements of sales development and business growth in Winbond. Mr. Ching-Chu Chang titled as the deputy chairman and President is elected as the deputy chairman and deputy CEO. In the future Mr. Ching-Chu Chang is going to assist CEO in driving business strategies of Winbond.

Mr. Tung-Yi Chan receives a Ph D. and a Master degree in Electrical Engineering from University of California, Berkeley, USA and also holds a Master degree in Management from Stanford University. Prior to joining Winbond, Mr. Chan was affiliated with international companies in USA including Intel, Cypress and Siliconix. He came to Winbond with extensive experiences in product and technology developments. From 1995 to 2000, he held various positions including the Director of research and development division in Winbond America, the AVP of Non-Volatile Memory (NVM) product center and the President of Winbond America. At that time he took on a heavy responsibility of establishing NOR Flash product line. As a captain of the NVM team, Mr. Chan succeed in building a strong foundation of product technology, developing business markets, and introducing new products to open the market entry. From 2000 to 2005, while transferred to serve as Technology Executive and Sales Vice President of Winbond headquarters, Mr. Chan continually made a significant contribution to expand product and sales markets. In October, 2005, Mr. Chan left Winbond for serving the post of CEO of BCD Semiconductor in Shanghai.

Driven by efforts over ten years, Winbond has became a key player in the NOR Flash field. As President, Mr. Chan expects to take advantages of his talent for product technology and product marketing to intensify Winbond’s strategic initiatives in the Flash memory industry. The object, leveraging Winbond’s leading position as a supplier of Specialty DRAM and NOR Flash, will also rely on Mr. Chan’s full-blown experience of business operation and management in both DRAM and Flash memory fields, his leadership of doing utmost to reach the goal and his global perspective. This designation, supported by the Board of Winbond, will enable the Company to achieve a further growth.

Winbond, the leading memory IC Company, centralizes its operating resources in competitive markets. In terms of DRAM business, thanks to the successful migration and mass production scheduled as planned, the 65nm Buried Wordline DRAM technology will be took advantages to develop low power consumption Mobile Memory. In the future, Winbond will continue moving forward with optimum competitiveness in the niche memory market by gaining advantages of faster cycle time, lower production cost, and better time to yield to meet the customer-driven demands. In the NOR Flash business, comprehending products of parallel Flash and serial Flash, the 90nm technology has been successfully developed and introduced to the 300mm wafer fab in the first quarter of 2009. Winbond has capability to offer a broader range of more cost-effective memory solutions for our computer, consumer and communication customers.



Spokesperson
    Wilson Wen
    Vice President of Administrative Center
    Tel:03-5792755

News Liaison
    Mike Liu
    Deputy Director
    Tel:0966-233360
    Email:ckliu@winbond.com

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