Taipei News) July 9, 2007 － Winbond Electronics Corp. today announced that the Board of Directors has approved a capital injection of USD 39 million to WEC Investment Holding Ltd. (WIH). The purpose of the capital injection is to finance the general working capital of Winbond Israel Ltd.
With years of deepened cultivation in the desktops, notebooks, and servers markets, Winbond leverages its position as a leading supplier of PC components and solutions. Winbond Israel Ltd. serves as the research and development center for notebook and server related ICs such as Super I/O, embedded controller and Trusted Platform Module (TPM) products, which, combined with Winbond’s advantage in the motherboard field, builds a versatile and complete Computer Logic IC product line providing advanced technology and cost-effective solutions for domestic and international customers.
Spokesperson
Wilson Wen
Vice President of Administrative Center
Tel：03-5792755
News Liaison
Mike Liu
Deputy Director
Tel：03-5792516
Email：ckliu@winbond.com