Winbond Electronics Corporation Signed a NT$ 3.7 Billion Syndicated Loan Agreement with 9 Domestic Banks

(Taipei News) Winbond Electronics Corporation today (15) announced that it has signed a NT$ 3.7 billion three-year syndicated loan agreement. The signing ceremony was hosted by Mr. Arthur Y.C. Chiao, Chairman of Winbond and delegates of domestic banking institutions at Winbond’s Taipei office. The main purpose of the agreement is to refund the long-term loan payments and to finance the general working capital of the Company.

The syndicated loan was led by Taiwan Bank, Chinatrust Commercial Bank, First Commercial Bank, Land Bank of Taiwan, Taishin International Bank, and consisted of other four financial institutions, all of which are with excellent operation performance. The enthusiasm received from the financial institutions represents their highly support to Winbond’s well credit rating and bright future.

    Wilson Wen
    Executive Vice President of Memory IC Manufacturing Business Group 

News Liaison
    Mike Liu
    Deputy Director

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