Winbond Announces the Financial Results for the Fourth Quarter of 2011

Hsinchu, Taiwan, February 08, 2012- Winbond Electronics Corporation today announced the results of audited financial figures for the fourth quarter of 2011. Revenue for the fourth quarter totaled NT$5.717 billion, down 17% QoQ and down 26% YoY. Net losses for the fourth quarter were NT$1.189 billion; loss per share was NT$0.32. For 2011, Winbond posted revenue of NT$27.214 billion, down 15% YoY, Net losses of NT$843 million, and loss per share of NT$0.23.


Winbond’s Q4 revenue and profits declined due to: (1) flood damage in Thailand which brought negative impact on the HDD supply chain, (2) price erosion ,and (3) the weak demand for personal computers, TV and features phones. However, 46nm DRAM and 58nm Flash product will enter into mass production which will strengthen price competitiveness. To break down revenue by product lines, Specialty DRAM accounted for 47%, NOR Flash at 37% and Mobile RAM at 14%. Revenue by product lines of Q4 was similar to that of Q3.


Looking forward into the year of 2012, Winbond will continue to focus on low to medium-density memory products, enhancement of product competitiveness with technology migration. It will also develop various new product lines. The Flash product line will have small factor package products to expand the market share in networking applications and hand-held devices, plus the development of NAND Flash. NAND flash is expected to release at the end of 2012 and the beginning of 2013. For Specialty DRAM, Winbond foresees a gradual demand recovery in HDD segment in 1H12, so it will continue to improve specialty DRAM product mix to pursue business growth and achieve stable profitability. For Mobile RAM, Winbond will drive into 46nm product development, strengthen its medium-density, Low Power DRAM product in peripheral module products and hand-held device applications, increase revenue of high-density Pseudo RAM. Winbond is prudently optimistic to pursue business growth in 2012.

James Wen
    Vice President of Finance Center & CFO

News Liaison
   Vick Liu
    Investor Relations Dept.

    Email HYLiu4@winbond.com

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