Winbond Electronics Corporation Signed an NT$ 9 Billion Syndicated Loan Agreement

Hsinchu, Taiwan, July 07, 2014-Winbond Electronics Corporation today announced that it has signed an NT$ 9 billion five-year syndicated loan agreement. The signing ceremony was hosted by Mr. Arthur Y.C. Chiao, Chairman of Winbond and Mr. James Chen, President of Chinatrust Commercial Bank at Sherwood Hotel Taipei. The main purpose of the syndicated loan is to finance equipments for technology upgrade, production capacity expansion and the working capital needs.

The syndicated loan was led by Chinatrust Commercial Bank, Taishin International Bank, First Commercial Bank, DBS Bank (Taiwan), China Development Industrial Bank, Chang Hwa Commercial Bank and participated by seven other financial institutions. The loan was oversubscribed and final facility amount was closed at NT$ 9 billion. The oversubscription represents banks’ recognition of Winbond’s credit standing and positive outlook.

Winbond is a leading supplier of Specialty Memory with three major product lines including Specialty DRAM, Mobile DRAM, and Code Storage Flash Memory. We are able to provide tier-1 customers with comprehensive product solutions through technology migration and capacity expansion. With funds in place, Winbond will continue to generate stable profitability and achieve sustainable competitive advantages. 

Corporate Spokesperson
James  Wen
Finance Center  Vice President
TEL: 886-3-5678168

News Liaison
Mandy  Wang
Investor Relationship Dept.
TEL: 886-3-5678168 #81477

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