Taipei, Taiwan, R.O.C. – May. 08, 2025 – Winbond Electronics Corporation today held the signing ceremony for its NT$25 billion seven-year sustainability-linked syndicated loan at the Le Méridien Taipei. The event was jointly hosted by Mr. Arthur Yu-Cheng Chiao, Chairman of Winbond Electronics, and Mr. James Chen, Chairman of CTBC Bank. This syndicated loan is jointly arranged by CTBC Bank, Bank of Taiwan, First Commercial Bank, Taiwan Cooperative Bank, Taishin International Bank, Mega International Commercial Bank, DBS Bank (Taiwan) Ltd., Chang Hwa Commercial Bank, Taipei Fubon Commercial Bank, and Hua Nan Commercial Bank. In total, 17 financially sound institutions participated in this syndication.
The primary purpose of the facility is to enhance Winbond’s working capital flexibility. Driven by Winbond’s strong operational performance in 2024, the syndicated loan received overwhelming support from the participating banks, with a subscription rate exceeding 200%. The final loan amount of NT$25 billion reflects the banking group’s strong confidence in Winbond’s solid and stable operations.
This sustainability-linked syndicated loan demonstrates the banking consortium’s strong recognition of Winbond’s recent efforts in strengthening cybersecurity, advancing AI technologies, and promoting green products. This marks not only a significant milestone in the financial sector’s commitment to sustainable finance but also a strong endorsement of Winbond’s vision statement “be a hidden champion in providing sustainable semiconductors to enrich human life”. Through continuous advancements in cybersecurity, AI innovation, and green manufacturing, Winbond and its partner banks leverage their respective strengths and share a common mission to promote social and environmental sustainability.
Winbond is dedicated to providing comprehensive IC products and solutions to global customers, including Code Storage Flash Memory, TrustME® Secure Flash, Customized Memory Solutions (CMS), and a wide range of logic IC products and solutions. As one of the few companies worldwide with in-house memory and logic IC design and technologies, Winbond leverages its proprietary R&D capabilities and carefully planned capacity strategies to build a highly flexible production system. This enhances overall operational resilience, meets diverse customer needs with agility, and strengthens the company’s global brand presence—continually increasing Winbond’s visibility and influence in the international market.
Spokesperson
Hsiang-Yun Fan
Executive Vice President
TEL:
886-3-5678168
886-987-365682
News Liaison
Kira Hsu
Public Relations
TEL:
886-3-5678168 #76520
886-978-066520
E-mail: syhsu6@winbond.com