EnglishKaohsiung, Taiwan, R.O.C. – Dec. 24, 2025 – Winbond Electronics Corporation (“Winbond”) and ChipMOS Technologies Inc. ("ChipMOS") today (24th) jointly hosted the “Silicon in Synergy: Sustainable Basketball Donation Program” at Ji-An Elementary School in Tainan and Dashu Elementary School in Kaohsiung. Through tangible actions, the two companies brought the concepts of circular economy and sustainable development into campuses, demonstrating concrete results of industry–education collaboration and effective public–private partnerships.
Winbond and ChipMOS stated that the selection of recipient schools was guided by a commitment to deepening students’ understanding of circular economy principles and sustainable education, while also emphasizing local engagement and social contribution. Considering the relatively limited educational resources available to rural and resource-disadvantaged schools (often categorized as "neither mountainous nor urban"), employees from both companies collectively sponsored more than 700 basketballs filled with goodwill and care. These basketballs were donated to 20 rural elementary schools across Tainan and Kaohsiung, helping to enhance campus sports facilities and learning resources.
The two companies further pointed out that industrial water use in the Kaohsiung region is closely linked to the local environment. In addition to continuing efforts in carbon reduction and green transformation, enterprises should also invest collaboratively in environmental restoration and biodiversity management, thereby strengthening operational resilience and reinforcing connections with local communities.
Moreover, Winbond and ChipMOS have accumulated three years of collaborative experience in carbon management and green electricity products. Looking ahead, they will continue to leverage supply-chain collaboration to expand the social impact of their sustainability initiatives. The basketballs for this donation were manufactured by Semisils Applied Materials, a company employing a zero-waste circular production process. With the support of the Teacher Education Center and the Center for Corporate Sustainable Development at National Kaohsiung Normal University, this cross-sector collaboration successfully aligns with the United Nations Sustainable Development Goals (SDGs), including SDG 4 (Quality Education), SDG 7 (Reduced Inequalities), and SDG 12 (Responsible Consumption and Production). By integrating sustainable governance concepts across the semiconductor supply chain, Winbond and ChipMOS aim to encourage supply chain partners to actively address environmental protection and social well-being while pursuing business growth.
Spokesperson
Hsiang-Yun Fan
Executive Vice President
TEL:
886-3-5678168
886-987-365682
News Liaison
Kira Hsu
Investor Relations Department I
TEL:
886-3-5678168 #76520
886-978-066520
E-mail: syhsu6@winbond.com