EnglishHsinchu, Taiwan, R.O.C. – Jan. 30, 2025 – In response to the escalating challenges posed by global climate change, corporate sustainability has evolved beyond commitments toward concrete, science-based action. Winbond Electronics Corporation (TWSE: 2344) today announced that its greenhouse gas (GHG) emissions reduction targets have been officially validated by the Science Based Targets initiative (SBTi) as of January 8, 2026, underscoring the Winbond Group’s firm commitment to advancing climate action through scientific governance and a systematic, long-term approach.
Using 2023 as the base year, Winbond has established GHG reduction targets covering its entire value chain, with the ultimate goal of achieving Net-Zero emissions by 2050. These targets are fully aligned with the goals of the Paris Agreement, aiming to limit the global average temperature increase to 1.5°C, demonstrating the close integration of Winbond’s business strategy with international climate action frameworks.
Near-Term Targets (2030)
Winbond commits to a 42% absolute reduction in Scope 1 (direct emissions from operations) and Scope 2 (indirect emissions from purchased energy) GHG emissions by 2030, compared to the 2023 base year. In parallel, Winbond pledges a 25% absolute reduction in Scope 3 emissions, including emissions arising from purchased goods and services as well as the use of sold products by fostering deep collaboration with supply chain partners.
Long-Term Net-Zero Targets (2050)
Looking further ahead, Winbond has established its 2050 long-term targets, planning to reduce absolute Scope 1 and Scope 2 emissions by 90%, while achieving a corresponding 90% reduction in Scope 3 emissions, progressively realizing a full-scale Net-Zero transformation across its entire value chain.
The validation of Winbond’s SBTi targets underscores the company’s tangible progress in aligning with international climate governance standards. By leveraging technological innovation, operational resilience, and a robust governance framework, Winbond continues to play a pivotal role in the semiconductor sector, spearheading a steady transition toward a low-carbon and sustainable future.
Spokesperson
Hsiang-Yun Fan
Executive Vice President
TEL:
886-3-5678168
886-987-365682
News Liaison
Kira Hsu
Investor Relations Department I
TEL:
886-3-5678168 #76520
886-978-066520
E-mail: syhsu6@winbond.com