EnglishHsinchu, Taiwan, R.O.C. – Sep. 16, 2026 – Winbond Electronics Corporation (“Winbond”) today announced that it has entered into a stock purchase agreement with Infineon Technologies LLC, a subsidiary of Infineon Technologies AG (“Infineon”), to acquire, in an all-cash transaction, 100% of the equity interest in Infineon’s NOR Flash and F-RAM business (the “Company”). The transaction is valued at a base purchase price of US$1.12 billion, subject to customary adjustments prior to closing as stipulated in the stock purchase agreement (the “Transaction”). The Transaction has been approved by Winbond’s Board of Directors.
The Transaction is expected to expand Winbond’s global research and development resources and enhance supply capabilities and services to global customers. Winbond is expected to bring over talents from more than 10 countries with additional supply chain partners. Headquartered in San Jose, California, the Company has over 30 years of experience in memory solutions and has earned the trust of its customers through its comprehensive and differentiated product portfolio. Upon closing of the Transaction, the Company will be named Spansion.
“We are excited to bring back the “Spansion” company name and trademark. Spansion was a pioneer of the industry and made many innovations and technological breakthroughs that contributed to the IT industry. We are honored to be able to carry on the torch under this name again,” said Arthur Yu-Cheng Chiao, Chairman and CEO of Winbond.
The Transaction is expected to close in the second half of calendar year 2027, subject to the satisfaction of closing conditions set forth in the stock purchase agreement, including the receipt of required regulatory approvals. Upon completion of the Transaction, Winbond will directly or indirectly hold 100% of the equity interests in the Company. The Company will operate as a standalone entity in line with its past practice with its headquarters in the United States.
About Winbond
Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park (CTSP), Taichung, Taiwan and operates two 12-inch highly intelligent and automated fabs located in CTSP and South Taiwan Science Park (STSP)’s Kaohsiung Science Park. Winbond endeavors to provide its global clientele with total integrated circuits solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash, Customized Memory Solution (CMS), and various Logic IC solutions.
About Infineon
Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. Infineon had around 57,000 employees worldwide (end of September 2025) and generated revenue of about €14.7 billion in the 2025 fiscal year (ending 30 September). Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the OTCQX International over-the-counter market (ticker symbol: IFNNY).
Spokesperson
Hsiang-Yun Fan
Executive Vice President
TEL:
886-3-5678168
886-987-365682
News Liaison
Kira Hsu
Investor Relations Department I
TEL:
886-3-5678168 #76520
886-978-066520
E-mail: syhsu6@winbond.com