Products & Technology

Description

Date
Description Winbond has unveiled its latest 1Gb QspiNAND Flash for wearable and low-power IoT devices

Date 2024-08-07
Description Winbond extends its secure flash family with new memory densities, PQC support and secure supply chain management

Date 2024-03-27
Description Winbond Introduces Innovative CUBE Architecture for Powerful Edge AI Devices

Date 2023-09-27
Description Winbond and Mobiveil Collaborate on Ultra-Low Power Applications

Date 2023-08-30
Description Winbond Earns ISO/SAE 21434 Certification for W77Q Secure Flash, Becoming the World's First Memory IC Vendor to Achieve this Milestone

Date 2023-08-08
Description Winbond introduces the next generation 8Mb Serial Flash – W25Q80RV for low power and small form factor IoT devices

Date 2023-06-15
Description Winbond Sets Global Sustainability Standard with Sustainability Initiatives and Products

Date 2023-04-26
Description Winbond joins STMicroelectronics Partner Program to combine high-performance memory with STM32 devices in smart industrial and consumer applications

Date 2023-03-28
Description Winbond joins UCIe Consortium to support high-performance chiplet interface standardization

Date 2023-02-15
Description Winbond HYPERRAM™ 3.0 wins 7th China IoT Innovation Awards 2022

Date 2022-12-09