Winbond Displays Competitive IC Products at eMEX 2006

Winbond 2006 eMEX

Date: October18-21
Location: Suzhou International Expo Center, Expo Plaza, Suzhou Industrial Park
Booth: 4H02 , Hall 4A

Winbond is going to show our latest products and solutions at eMEX 2006. Winbond is the leading ICs manufacturer in Taiwan. We design and manufacture ICs products in four major fields: Mobile RAM, Computer Logic IC, uC & uC-based Consumer IC and Flash Memory. 

eMEX 2006 is going to be hold at Suzhou International Expo Center(4H02, Hall 4A) during Oct.18-21. Winbond will join eMEX with the integration of Walsin Group: PSA(Passive System Alliance), Hannstar, Hannspree and tMt(Touch Micro-system Technology). Meanwhile, Winbond will focus on our competitive products including Microcontroller, DRAM, SDRAM, Pseudo SRAM, Flash Memory and Voice Speech ICs with our full support and quality service. We look forward to your visit at our booth!

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Contact Us:

Erin Chou
TEL: 886-3-5678168 #8686
Winbond Sales Promotion Dept. 
Email: ChChou7@winbond.com

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