Winbond 2006 eMEX
Date: October18-21
Location: Suzhou International Expo Center, Expo Plaza, Suzhou Industrial Park
Booth: 4H02 , Hall 4A
Winbond is going to show our latest products and solutions at eMEX 2006. Winbond is the leading ICs manufacturer in Taiwan. We design and manufacture ICs products in four major fields: Mobile RAM, Computer Logic IC, uC & uC-based Consumer IC and Flash Memory.
eMEX 2006 is going to be hold at Suzhou International Expo Center(4H02, Hall 4A) during Oct.18-21. Winbond will join eMEX with the integration of Walsin Group: PSA(Passive System Alliance), Hannstar, Hannspree and tMt(Touch Micro-system Technology). Meanwhile, Winbond will focus on our competitive products including Microcontroller, DRAM, SDRAM, Pseudo SRAM, Flash Memory and Voice Speech ICs with our full support and quality service. We look forward to your visit at our booth!
Display Items:
- Winbond 8bit MCU/32bit SoC
- Winbond SDRAM:64Mb(W9864 Series), 128Mb(W9812 Series) and 256Mb(W9825 Series)
- Winbond 256Mb LowPower DRAM
- Winbond Pseudo SRAM(W96 Series)
- Winbond ISD1700 Voice&Speech ICs (ChipCorder®)
- Winbond Single Programmable Extended CODEC/SLIC IC for the VoIP Market
- Winbond Serial Flash Memories
Contact Us:
Erin Chou
TEL: 886-3-5678168 #8686
Winbond Sales Promotion Dept.
Email: ChChou7@winbond.com