Code Storage Flash

Empowering Next-Gen Embedded Designs

As a leading global supplier of semiconductor memory solutions, Winbond offers a comprehensive portfolio of Code Storage Flash, including NOR Flash, NAND Flash, and TrustME^® Secure Flash. Our products are engineered for high performance, low power consumption, and space-efficient packaging, offering a wide range of densities to meet diverse design requirements. This makes them the ideal choice for automotive, industrial, and consumer electronics across a broad range of applications.

TrustME^® Secure Flash

Winbond’s TrustME^® Secure Flash provides a hardware-based Root of Trust (RoT) to protect systems from code tampering and cyberattacks, with densities ranging from 4Mb to 1Gb. The W77Q series serves as a secure drop-in replacement for standard NOR Flash featuring NIST 800-193 resiliency and Post-Quantum Cryptography (PQC). The W77T series complies with ISO 21434, ISO 26262, and Common Criteria EAL2+ security certification, while the W75F series meets more stringent security requirements with Common Criteria EAL5+ certification. These solutions ensure supply chain integrity and are ideal for automotive, server platforms, and high-security IoT applications. To learn more about each product category, please visit our product pages:
TrustME^® Secure Flash

NOR Flash

Winbond’s NOR Flash portfolio offers densities from 2Mb to 2Gb at 3V, 1.8V, and 1.2V, supporting SPI, Dual/Quad interfaces. Most devices come in SOP-8, SOP-16, SON-8, BGA-24, and the newly introduced WQFN-12 packages. For high-performance applications, Winbond also offers Octal NOR Flash, delivering the highest synchronous byte-wide (8-bit) data bandwidth for code and data storage in instant-on and eXecute-in-Place (XiP) embedded applications, with an extreme bandwidth up to 400 MB/s. The portfolio also includes automotive-grade products to meet stringent industry standards. For System-in-Package (SiP) solutions, Winbond offers Known Good Die (KGD) options that allow Flash dies to be stacked with controllers or other components. These dies undergo 100% baking and testing to ensure reliability comparable to packaged parts. Featuring Re-Distribution Layer (RDL) capability for flexible pad layouts, our KGD solutions provide a secure, space-efficient, and cost-effective alternative for compact designs. To learn more about each product category, please visit our product pages:
QSPI NOR, Octal NOR, Authentication, KGD

NAND Flash

Winbond’s NAND Flash portfolio provides high-density, non-volatile storage in a compact form factor, making it ideal for modern embedded systems. It includes QSPI NAND, Octal NAND and ONFI NAND, covering densities from 512Mb to 8Gb. QSPI and Octal NAND features Built-in ECC, Bad Block Management Lookup Table (BBM LUT), Advanced Continuous Read, and other advanced capabilities. These devices simplify software development and enhance system reliability. The Octal NAND, is the industry’s first 8 I/O interface with a Double Transfer Rate (DTR), achieving a read throughput up to 240 MB/s for high-performance applications. With automotive-grade 2 and 2+ qualifications, it ensures stable and reliable storage performance across both industrial and automotive environments. To learn more about each product category, please visit our product pages:
QSPI NAND, Octal NAND, ONFI NAND

MCP

Winbond offers stacked-die solutions to address the increasing demand for high-density storage in space-constrained designs. MCP solutions combine 1.8V ONFI NAND Flash with LPDDR2 or LPDDR4x in a compact package, minimizing PCB footprint and data-transfer latency. These solutions enhance manufacturing efficiency and are ideal for smart wearables, mobile and industrial IoT applications. To learn more about this product category, please visit our product page:
MCP

SpiStack^® Combo Flash

Winbond offers innovative stacked-die solutions to address the increasing demand for high-density storage in space-constrained designs. SpiStack^® leverages a unique C2h command to integrate multiple independently addressable dies such as NOR+NOR, NAND+NAND, NOR+NAND, or NOR+pSRAM into a single package, enabling flexible and efficient system operation. These solutions are ideal for smart wearables, mobile and industrial IoT applications. To learn more about this product category, please visit our product page:
SpiStack^® Combo Flash