QSPI NOR

High-Performance and Low-Power Serial Memory Solutions

The W25Q and W25H QSPI NOR offer robust non-volatile memory solutions designed to meet the rigorous demands of modern embedded systems. Supporting Single, Dual, and Quad I/O modes , the architecture delivers high bandwidth performance in small form factors. This combination of efficiency and compact design makes the family ideal for code shadowing and direct code execution in space-constrained applications ranging from mobile devices to industrial automation.

Low power consumption

To accommodate diverse power profiles and advanced system designs, the product line offers a comprehensive spectrum of voltage options tailored to specific application needs. Besides standard 3V and 1.8V solutions, we offer the following:

• 1.2V : Suitable for advanced technology nodes, this solution is ideal for pairing with advanced-process SoCs such as high-compute AI accelerator chips, high-end edge computing processors, advanced high-bandwidth network interface cards, and AI-enabled wearable devices.
• 1.8V with 1.2V I/O Support : Supports 1.2V I/O operation, enabling direct interface with advanced SoCs without the need for external level shifters. By retaining a 1.8V main supply (VCC), this design achieves faster program and erase performance than pure 1.2V devices, offering superior efficiency for high-performance applications.

Advanced packaging solutions

Beyond standard SOP package and space-saving WSON and USON packages for compact designs, for ultra-thin and miniature applications, Wafer Level Chip Scale Packages (WLCSP) and Known Good Die (KGD) options are available, providing maximum flexibility for System-in-Package (SiP) integration. Winbond also innovate to bring up the industry first:

• WQFN-12 : The industry’s first 12-pin 5x6mm WQFN package. For QSPI NOR products with more than 8 pins, the industry typically requires 10x10mm SOP16 or 8x6mm TFBGA packaging. The Winbond WQFN 12 package adds four additional pins while maintaining the same 5x6mm SON package used for standard 8 pin devices. The additional pins include Busy Output, RESET, Write Protection, and VIO, which enables a 1.2 V I/O reference voltage. By enabling these advanced features and reducing board space, the WQFN-12 significantly enhances memory efficiency and system stability, offering a cost-effective alternative for high-performance applications such as Over-the-Air (OTA) firmware updates.
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• 4x4 XSON : Utilizing an advanced 45nm process technology, Winbond offers the industry’s first 256Mb density in an ultra-compact 4x4mm XSON package. In the current market, the highest capacity supported in this footprint is typically limited to 128Mb. This breakthrough overcomes that limitation, maximizing storage density for space-constrained applications such as True Wireless Stereo (TWS) and wearables.
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Security & reliability

Provides an ideal solution for Over-the-Air (OTA) updates, featuring FlexProtect for dynamic range protection and Individual Block Protection with password-based locking to secure critical code regions. In addition, Blank Check by Read and Advanced Chip Erase streamline manufacturing efficiency and ensure secure erasure.

Designed for mission-critical automotive applications such as ADAS, domain controller, eCockpit and sensor, the W25H Series complies with ISO 26262 functional safety standards. To ensure superior data accuracy, the new W25H-RV series features On-chip Checksum Calculation to verify data integrity without burdening the host processor, alongside Built-in ECC for automatic error correction and detection.

The W25Q and W25H QSPI NOR deliver a comprehensive memory solution that balances high-performance data transfer with superior power efficiency. From the versatile voltage options and ultra-compact packaging, our portfolio is engineered to meet the diverse needs of modern electronics. Whether for IoT endpoints, advanced automotive systems, or industrial automation, Winbond provides the reliability, scalability, and long-term support required to drive innovation forward.

Series List