Winbond leverages advanced manufacturing processes to provide high-quality, high speed, and wide temperature range Known Good Die (KGD) wafers. We also offer electrical simulation, wafer-level speed testing, and other services to enhance product compatibility with SOC for KGD customers. Many customers have leveraged Winbond’s expertise to integrate KGD into system-in-package (SiP) solutions.
Winbond also provides redistribution layers (RDL) for KGD users, offering additional flexibility for customers who require different pad layouts. This enables cost-effective, space-efficient solutions, overcoming the limitations of standard memory designs.
In terms of failure analysis (FA), Winbond’s analysis laboratory is equipped with SiP re-packaging technology which offers well established FA services. We have professional team and advanced equipment, enabling us to deliver efficient, accurate, and comprehensive failure analysis services to help customers resolve various technical issues.
Winbond KGD offers comprehensive service from design, mass production to FA analysis which fulfill the true spirit of CMS (Customer Memory Solution).
