W75F Secure Memory Element
W75F Secure Flash Solution is the first secure flash memory device to gain a Common Criteria (CC) EAL 5+ certificate. W75F enables secure eXecute-in-Place (XiP) and protects confidentiality and integrity of code / data in IoT devices. Application usage case include, but not limited to integrated UICC, integrated Secure Element, Artificial Intelligence (AI) platforms, integrated Hardware Security Modules (HSM) for automotive subsystems. The W75F provides the industry’s most secure external storage for code and data. It offers a dependable solution for manufacturers of connected devices who want to defend their products against threats such as replay, roll-back, man-in-the-middle, sniffing, side-channel and fault injection attacks.
In 2020, W75F has achieved PSA Certified™ Level 2 ready in the PSA Certified independent security assurance scheme, also obtained ISO 26262 ASIL-D ready and SESIP Level 3 certificate with physical and software attacker resistance.
With PSA Certified™ Level 2 ready and the certificates aforementioned, W75F not only can provide a secure, certifiable, and flexible memory sub-system complementary to Arm®v8-M architecture-based systems, but also can ensure the security for IoT, automotive and Artificial Intelligence (AI) platforms. This enables SoC and MCU vendors to design secure and certifiable solutions while expediting time to market.
- The world's first Secure Flash device with Common Criteria EAL 5+, PSA Certified™ Level 2 ready, SESIP Level 3 with physical attack and software attacker resistance and ISO 26262 ASIL-D ready certified
- Bolt-on security for IoT, automotive and artificial intelligence (AI) platforms
- Complementary solution for Arm®v8-M and Arm®v8-A TEE sub-system
- In-band integrity check protects the interface
- Flexible secure memory architecture
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The TrustME® W75F Secure Memory Element Features:
- Common Criteria EAL 5+ certified
- PSA Certified™ Level 2 Ready Certified
- SESIP Level 3 + Physical Attack Resistance and Software Attacker Resistance: Isolation of Platform
- ISO 26262 ASIL-D Ready Certified
- ISO 21434 Automotive Cybersecurity certification (in progress)
- Secure eXecute-in-Place (XiP)
- Tamper and SCA/DPA Resistant Secure Flash Device
- Code and Data Confidentiality and Integrity
- Mutual Authentication with SoC
- Secure standard/Quad/Octal SPI
- Support shared memory architecture for Multiple-Domains
- Support AEC-Q100 with AG2 qualification available or upon request
- Trusted Computing Group (TCG) DICE Compliance
- 21 MByte/sec secured and authenticated throughput
- 100,000 program/erase cycles
- 20-year data retention
─Low Power, Wide Temperature Range
- Single 1.65 to 1.95V supply
- 2mA active current, <1μA Power-down
- -40°C to +105°C operating range
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Density
Part No. |
Voltage |
Speed |
Temp. |
Features |
Status |
Industrial Datasheet |
Automotive |
Industrial |
W75F32WSFJ |
1.65-1.95V |
50 MHz |
-40℃ ~ 105℃ |
Secure eXecute-in-Place (XiP) • Tamper and SCA/DPA resistant • Code and data confidentiality and integrity • Mutual authentication with SoC </div> |
UD |
S |
Contact us
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W75F32WQ3J |
1.65-1.95V |
50 MHz |
-40℃ ~ 105℃ |
Secure eXecute-in-Place (XiP) • Tamper and SCA/DPA resistant • Code and data confidentiality and integrity • Mutual authentication with SoC </div> |
UD |
S |
Contact us
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Technical Documentation
Resources
Winbond and Secure-IC in Partnership for Embedded Cybersecurity
Video
- File Type:Video
- Updated:04/05/2023
- Watch
Winbond TrustME® Secure Flash Product Brief
Product Brief
- File Type:pdf
- Updated:05/03/2023
- Download
Winbond TrustME® Security Solution
Video
- File Type:Video
- Updated:24/09/2020
- Watch
Winbond TrustME Secure Flash - A Robust and Certifiable Secure Storage Solution
Video
- File Type:Video
- Updated:24/09/2020
- Watch
Winbond embedded world 2018_Security Flash
Video
- File Type:Video
- Updated:24/09/2020
- Watch