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TAICHUNG, Taiwan– 2025-12-03 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the release of its new 8Gb DDR4 DRAM, developed using Winbond’s in-house advanced 16nm process technology, delivering higher speed, lower power consumption, an...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2025_1203_winbond_8gb_ddr4_dram_16nm_industrial_embedded.html?__locale=en

https://www.winbond.com/hq/hq/about-winbond/company-profile/milestones/?__locale=en

https://www.winbond.com/hq/about-winbond/news-and-events/news/2026_1104_winbond_16nm_dram_ddr4_lpddr4

TAICHUNG, Taiwan– 2023-09-27– Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, has unveiled a powerful enabling technology for affordable Edge AI computing in mainstream use cases. The Company’s new customized ultra-bandwidth elements (CUBE) enable memory...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2023_0927_winbond_innovative_cube_architecture_edge_ai.html?__locale=en

(HSINCHU, Taiwan –30 October, 2019) With the rapid rise of automotive electronics, industrial 4.0, and smart home applications, new IoT edge devices and human-machine interface devices will require new functionality in terms of size, power consumption, and performance. In view of this, many MCU supp...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-hyperram-can-address-new-aiot-application-needs.html?__locale=en

https://www.winbond.com/hq/support/online-learning/articles-item/Memory-Innovation-at-the-Edge-Power-Efficiency-Meets-Green-Manufacturing