Search

https://www.winbond.com/productResource-files/Winbond Octal NOR Flash Product Brief.pdf

High bandwidth Octal interface 1.8V NOR Flash in densities from 64Mb to 2Gb Winbond W35T Octal NOR Flash family with the JEDEC xSPI interface offers a combination of high bandwidth, advanced features, and exceptional reliability. Winbond’s Octal NOR Flash delivers the highest synchronous byte-wide (...

https://www.winbond.com/hq/hq/product/code-storage-flash-memory/octal-nor-flash/index.html?__locale=en

https://www.winbond.com/hq/about-winbond/news-and-events/events/product-promotion/Winbond-Will-Join-FMS-on-Santa-Clara-Convention-Center

[Event Information] electronica 2024: electronica 2024 is a premier global trade show for the electronics industry, featuring innovations in automotive, AI, IoT, and industrial electronics, and uniting industry leaders to explore future trends and solutions. Winbond, in collaboration with PSA (Passi...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/events/product-promotion/promotion00023.html?__locale=en

(Taipei News) Winbond Electronics Corporation, a leading supplier of semiconductor solutions, today announced revenue results for the month of December 2002. Revenue for the month was approximately NT $2.536 billion, an increase of 24.43 percent, when compared with NT $2.038 billion over the same pe...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00110.html?__locale=en

Taichung, Taiwan – 2024-12-11 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today unveils the TrustME® W77T Secure Flash family, specifically designed for the automotive industry. This ISO26262 ASIL-D Ready, ISO21434 Certified, UNECE WP.29 and TISAX ...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2024_1211_winbond_automotive_w77t_secure_flash-memory.html?__locale=en

https://www.winbond.com/hq/about-winbond/news-and-events/events/product-promotion/Winbond-Will-Join-Embedded-World-2025

TAICHUNG, Taiwan and YOKOHAMA, Japan– 2021-07-07 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, announced today the official confirmation that its HyperRAM™ and SpiStack® (NOR+NAND) can be operated with Renesas’ RZ/A2M Arm®-based microprocessors (MPUs...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-hyperram-and-spistack-and-renesas-rza2m-accelerate-embedded-ai-system.html?__locale=en

Winbond’s 256Mb HyperRAM 2.0e KGD (Known Good Die) provides the Efinix® Titanium Ti60 F100 FPGA with the performance, low power consumption and small size needed for embedded AI applications at the edge Requiring only 22 signal pins versus the standard 31-38 needed by legacy DRAM, Winbond’s HyperRAM...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/efinix-selects-winbond-hyperram-to-drive-a-new-generation-of-compact-ultra-low-power-ai-and-iot-devices.html?__locale=en