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W66AGG6TB DDR4 DDP 16Gbits verilog model
Verilog Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA02-KAA129_3.html&level=1
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W664GG8RB protected verilog model
Verilog Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA02-JAA123_1.html&level=1
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W664GG6RB protected verilog model
Verilog Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA02-JAA123.html&level=1
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DDR4 PCB Layout Guide
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA01-JAA123.html&level=1
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Winbond Launches 8Gb DDR4 DRAM Built on Advanced 16nm Process Technology for Industrial and Embedded Applications
News
TAICHUNG, Taiwan– 2025-12-03 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the release of its new 8Gb DDR4 DRAM, developed using Winbond’s in-house advanced 16nm process technology, delivering higher speed, lower power consumption, an...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2025_1203_winbond_8gb_ddr4_dram_16nm_industrial_embedded.html?__locale=en
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W664GG8RB 4G bits DDR4 VFBGA 78 Ball (7.5x11 mm2 with 1.0 mm thickness) Hspice Model
SPICE Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA04-JAA123_2.html&level=1
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W664GG8RB 4G bits DDR4 VFBGA 78 Ball (7.5x11 mm2 with 1.0 mm thickness) IBIS Model
IBIS Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA03-JAA123_1.html&level=1
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W664GG6RB 4G bits DDR4 VFBGA 96 Ball (7.5x13 mm2 with 1.0 mm thickness) IBIS Model
IBIS Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA03-JAA123.html&level=1
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W664GG8RB 512Mx8 DDR4 VFBGA 78 ball package datasheet for general customer (Rev: A03-20250827)
Datasheet
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA00-W664GG8RB.html&level=1
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W664GG6RB 256Mx16 DDR4 VFBGA 96 datasheet for general customer (Rev: A04-20250731)
Datasheet
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA00-W664GG6RB.html&level=1
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W664GG6RB 4G bits DDR4 VFBGA 96 Ball (7.5x13 mm2 with 1.0 mm thickness) Hspice Model
SPICE Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA04-JAA123_1.html&level=1
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Winbond’s LPDDR4/4X 100BGA achieves JEDEC standard for improved energy conservation and carbon reduction in a smaller package size
News
TAICHUNG, Taiwan– 2022-07-27 –Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that its new package 100BGA LPDDR4/4X had achieved the JEDEC JED209-4 standard to ensure energy conservation and carbon reduction. The LPDDR4/4X is now availabl...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/Winbond-LPDDR4-4X-100BGA-JEDEC-standard-improved-energy-carbon-smaller-package-size.html?__locale=en
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Winbond Announces 1H24 Business Results
News
Hsinchu, Taiwan, Aug. 02, 2024- Winbond Electronics Corporation today announced its first half 2024 business results. The consolidated revenue for 1H24 was NT$41.65 billion, with a net profit attributable to the parent company of NT$1.259 billion, resulting in earnings per share of NT$0.3. Revenue f...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00531.html?__locale=en
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Winbond Announces Q3 2025 Business Results
News
Hsinchu, Taiwan, R.O.C. - Nov. 05, 2025 - Winbond Electronics Corporation today announced its business results for the third quarter of 2025, consolidated revenue totaled NT$21.771 billion, an increase of 2.1% compared to the same period of 2024. The gross margin was 46.7% and net profit attributabl...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00567.html?__locale=en
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Customized Memory Solution
Customized Memory Solution
The Mission of CMS: Driving Energy Efficiency and Carbon Reduction At CMS, our mission goes beyond manufacturing with renewable energy. We prioritize understanding customer needs, addressing system-level challenges, and continuously innovating to develop products that minimize energy consumption—mak...
https://www.winbond.com/hq/hq/product/customized-memory-solution/index.html?__locale=en
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