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W664GG8RB protected verilog model
Verilog Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA02-JAA123_1.html&level=1
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W664GG6RB protected verilog model
Verilog Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA02-JAA123.html&level=1
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DDR4 PCB Layout Guide
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA01-JAA123.html&level=1
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Winbond Launches 8Gb DDR4 DRAM Built on Advanced 16nm Process Technology for Industrial and Embedded Applications
News
TAICHUNG, Taiwan– 2025-12-03 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the release of its new 8Gb DDR4 DRAM, developed using Winbond’s in-house advanced 16nm process technology, delivering higher speed, lower power consumption, an...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2025_1203_winbond_8gb_ddr4_dram_16nm_industrial_embedded.html?__locale=en
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W664GG8RB 4G bits DDR4 VFBGA 78 Ball (7.5x11 mm2 with 1.0 mm thickness) Hspice Model
SPICE Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA04-JAA123_2.html&level=1
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W664GG8RB 4G bits DDR4 VFBGA 78 Ball (7.5x11 mm2 with 1.0 mm thickness) IBIS Model
IBIS Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA03-JAA123_1.html&level=1
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W664GG6RB 4G bits DDR4 VFBGA 96 Ball (7.5x13 mm2 with 1.0 mm thickness) IBIS Model
IBIS Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA03-JAA123.html&level=1
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W664GG6RB 4G bits DDR4 VFBGA 96 Ball (7.5x13 mm2 with 1.0 mm thickness) Hspice Model
SPICE Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA04-JAA123_1.html&level=1
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W664GG8RB 512Mx8 DDR4 VFBGA 78 ball package datasheet for general customer (Rev: A03-20250827)
Datasheet
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA00-W664GG8RB.html&level=1
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W664GG6RB 256Mx16 DDR4 VFBGA 96 datasheet for general customer (Rev: A04-20250731)
Datasheet
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA00-W664GG6RB.html&level=1
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Winbond’s LPDDR4/4X 100BGA achieves JEDEC standard for improved energy conservation and carbon reduction in a smaller package size
News
TAICHUNG, Taiwan– 2022-07-27 –Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that its new package 100BGA LPDDR4/4X had achieved the JEDEC JED209-4 standard to ensure energy conservation and carbon reduction. The LPDDR4/4X is now availabl...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/Winbond-LPDDR4-4X-100BGA-JEDEC-standard-improved-energy-carbon-smaller-package-size.html?__locale=en
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Winbond Announces 1H24 Business Results
News
Hsinchu, Taiwan, Aug. 02, 2024- Winbond Electronics Corporation today announced its first half 2024 business results. The consolidated revenue for 1H24 was NT$41.65 billion, with a net profit attributable to the parent company of NT$1.259 billion, resulting in earnings per share of NT$0.3. Revenue f...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00531.html?__locale=en
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Customized Memory Solution
Customized Memory Solution
The Mission of CMS: Driving Energy Efficiency and Carbon Reduction At CMS, our mission goes beyond manufacturing with renewable energy. We prioritize understanding customer needs, addressing system-level challenges, and continuously innovating to develop products that minimize energy consumption—mak...
https://www.winbond.com/hq/hq/product/customized-memory-solution/index.html?__locale=en
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Winbond Announces Q3 2025 Business Results
News
Hsinchu, Taiwan, R.O.C. - Nov. 05, 2025 - Winbond Electronics Corporation today announced its business results for the third quarter of 2025, consolidated revenue totaled NT$21.771 billion, an increase of 2.1% compared to the same period of 2024. The gross margin was 46.7% and net profit attributabl...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00567.html?__locale=en
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Winbond Will Join electronica 2024 on Messe München
Event
[Event Information] electronica 2024: electronica 2024 is a premier global trade show for the electronics industry, featuring innovations in automotive, AI, IoT, and industrial electronics, and uniting industry leaders to explore future trends and solutions. Winbond, in collaboration with PSA (Passi...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/events/product-promotion/promotion00023.html?__locale=en
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